edfas.org 13 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO.2 NOTEWORTHY NEWS FIB SEM MEETING 2025 The 17th annual FIB SEM Meeting, to be held May 6-7, is returning to the Science and Engineering Hall at George Washington University in Washington, DC. The 2025 FIB SEM will feature presentations, tutorials, and posters by FIB users and vendors, highlighting new applications and the latest technology. The event offers plenty of technical content as well as opportunities for informal discussions with FIB colleagues. Continuing this year will be student awards for best oral and poster presentations. For more information, visit fibsem.net or email keana.scott@nist.gov or fibsem2025@fibsem.net. IPFA 2025 The 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) will be held August 5-8 at the Spice Convention Centre in Penang, Malaysia. The event will focus on cutting-edge research in failure analysis, reliability, and specialized technology within integrated circuits. Topics include advanced fault isolation techniques, physical and package-level failure analysis, transistor reliability, ESD, latch-up, and the integration of AI for failure detection and reliability assessments. The symposium is technically sponsored by the IEEE Electron Devices Society. For more information, visit the IPFA website at ipfaieee.org/2025.
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