edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 2 12 PROCESS MONITORING The integration of high-resolution SIMS in process monitoring workflows enables real-time feedback on material deposition, etching, and cleaning processes. This accelerates the optimization of fabrication parameters and enhances yield rates. DEFECT ANALYSIS SIMS contributes significantly to the analysis of buried defects by providing detailed elemental mapping. Combined with laser interferometer stage navigation, it ensures accurate localization and characterization of defects, aiding in process refinement. CONNECTIVITY WITH OTHER PROCESS CONTROL TOOLS The system’s design includes connectivity capabilities with other process control tools such as inspection tools, CD SEMs, and defect review SEMs. This interoperability facilitates seamless integration into existing workflows, enabling comprehensive analysis by correlating SIMS data with inspection results, critical dimension measurements, and defect characterization. Such connectivity enhances the decision-making process and streamlines quality assurance protocols. By incorporating high-resolution SIMS into process control protocols, manufacturers gain a robust tool for ensuring the reliability and performance of microelectronic devices. The synergy of SIMS with advanced imaging technologies exemplifies its transformative potential in next-generation semiconductor manufacturing. FUTURE DIRECTIONS The novel combination of LMAIS technology, a stable stage, and a SIMS unit paves the way for nanoanalytics beyond conventional methodologies. Future research can explore further optimization of the system for various applications, including the integration of additional ion sources or detectors to expand its analytical capabilities. Additionally, the development of more sophisticated automated workflows will enhance the system’s efficiency and application range. CONCLUSION By incorporating high-resolution SIMS into microelectronics workflows, manufacturers achieve unprecedented precision and insight into fabrication processes. Its adaptability for diverse tasks, seamless integration with complementary tools, and unparalleled analytical power make it indispensable for optimizing material properties, ensuring quality, and driving innovation in next-generation semiconductor manufacturing. REFERENCES 1. J.-N. Audinot, et al.: “Highest Resolution Chemical Imaging based on Secondary Ion Mass Spectrometry Performed on the Helium Ion Microscope,” Rep. Prog. Phys., 2021, 84, 2021, p. 105901, doi.org/ 10.1088/1361-6633/ac1e32. 2. Bischoff, et al.: “Liquid Metal Alloy Ion Sources—An Alternative for Focused Ion Beam Technology,” Appl. Phys. Rev. 3, 2016, p. 021101, doi.org/10.1063/1.4947095. 3. A. Nadzeyka, et al.: “Focused Ion Beams from GaBiLi Liquid Metal Alloy Ion Sources for Nanofabrication and Ion Imaging,” J. Vac. Sci. Technol. B, 41, 2023, p. 062802, doi.org/10.1116/6.0002918. 4. O. De Castro, et al.: “npSCOPE: A New Multimodal Instrument for In Situ Correlative Analysis of Nanoparticles,” Anal. Chem., 93, 2021, p. 14417–14424, doi.org/10.1021/acs.analchem.1c02337. ABOUT THE AUTHORS Peter Gnauck earned his Ph.D. in physics from the University of Tübingen in 2000. He worked at Carl Zeiss Microscopy for over two decades in various roles, specializing in electron microscopy and focused ion beam (FIB) technology. He then joined KLA as a product marketing manager for e-Beam overlay. Since 2024, he has been serving as global business development manager for FIB/ SEM systems at Raith GmbH. Alexander Ost has worked as an applications development engineer at Raith since March 2023. His main activities at Raith include performing customer demos and sample analysis on the Ionmaster system, developed in collaboration with the Luxembourg Institute of Science and Technology (LIST). Just before joining Raith, he completed his Ph.D. in physics at LIST and the University of Luxembourg on SIMS with focus on correlative high-resolution 2D as well as 3D imaging workflows and focused ion beam sputtering mechanisms. Torsten Richter joined the Raith Group as the VELION product manager in 2019 to oversee all market activities for FIB-related products. Most recently, he transitioned into the position of FIB program manager to foster nanoanalytics and ion microscopy. Richter obtained a diploma in physics from the University of Dortmund. Prior to joining Raith, he held similar positions at other nanotechnology companies, primarily in the field of nanoanalytics and surface characterization.
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