edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO.2 ABOUT THE COVER Laser-crafted sci-fi castle. This image showcases a large 100 μm-wide bulk structure holding 19 individual lamellae, each precisely targeting a specific memory layer within a 3D NAND stack. Photo by Arun Prabha, Zeiss Microscopy. First Place Winner in Black and White Images, 2024 EDFAS Photo Contest. A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS MAY 2025 | VOLUME 27 | ISSUE 2 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS DEPARTMENTS A Novel Ion Microscope for HighResolution Ion Imaging and SIMS Nanoanalytics with Precise Sample Navigation Peter Gnauck, Alexander Ost, and Torsten Richter This article introduces a novel system that integrates high-resolution 2D/3D imaging and secondary ion mass spectrometry nanoanalysis. Author Guidelines Author guidelines and a sample article are available at edfas. org. Potential authors should consult the guidelines for useful information prior to manuscript preparation. 4 8 2 GUEST EDITORIAL Steve Herschbein 24 PAINE CONFERENCE Michael DiBattista 26 2025 PHOTO CONTEST 27 2025 VIDEO CONTEST 28 DIRECTORY OF FA PROVIDERS Rosalinda Ring 30 EDUCATION NEWS Navid Asadi 32 LITERATURE REVIEW Michael R. Bruce 34 PRODUCT NEWS Ted Kolasa 37 ASM FACT SHEET 39 TRAINING CALENDAR Rosalinda Ring 42 GUEST COLUMN Paul Hale 44 ADVERTISERS INDEX Study about the Corrosion of SAC Solder Joints Under Various Conditions of Temperature and Salinity A. Guédon-Gracia, K.E. Akoda, J.-Y. Delétage, and H. Frémont Solder joints were electrically and mechanically tested and aged in a salt spray chamber to test the dynamics of the corrosion mechanism. 16 For the digital edition, log in to edfas.org, click on the “News & Magazines” tab, and select “EDFA Magazine.” Silicon Photonic Failure Analysis using Near Infrared Microscopy Arpan Dasgupta An emerging silicon photonic technique, near infrared microscopy, is proving useful for isolating unexpected light losses as a first pass. 4 16 8
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