edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 1 48 of lamellae can be created using a single probe tip, which only needs reshaping after a few days of heavy use. The tip can be sharpened with a simple reshaping operation that takes less than 30 minutes, and the needle can be reshaped multiple times before needing to be replaced; a new tip exchange takes only half an hour. This dramatically increases the productive uptime of the tool, and lowers the cost spent on consumables. For more information, visit zeiss.com. DEMONSTRATOR CT SYSTEM FOR HIGH-SPEED X-RAY INSPECTION Excillum AB, partnering with U.S.-based Pinnacle X-Ray Solutions LLC have established a demonstrator CT system for inspection of batteries and other components using Excillum MetalJet x-ray technology. The demonstration system in Atlanta is available for customers in industries including automotive and aerospace to explore manufacturing quality improvements and cost reduction opportunities. The capability of this groundbreaking technology enables it to be used for at-line, in-line, and end-of-line quality inspection, and to support ramp-up of production volumes in battery cell manufacturing and many other applications. PRODUCT NEWS Ted Kolasa, Northrop Grumman ted.kolasa@gmail.com PRESS RELEASE SUBMISSIONS: MAGAZINES@ASMINTERNATIONAL.ORG CROSSBEAM 550 SAMPLEFAB FIB-SEM The new ZEISS Crossbeam 550 Samplefab is a focused ion beam scanning electron microscope (FIB-SEM) optimized for fully automated preparation of transmission electron microscopy (TEM) samples (lamellae). Built for efficiency and throughput in the semiconductor lab, ZEISS Crossbeam 550 Samplefab provides recipe-based automation for the routine TEM sample preparation work of bulk milling, lift-out, and thinning at any number of target points on the sample. The solution promises an automation yield of > 90% for processing lamellae from bulk to TEM grid without operator intervention. Automated checks allow human interventions to ensure no lamellae are lost during processing, driving lamella success rates toward 100%. ZEISS Crossbeam 550 Samplefab uses the Gemini 2 electron column, allowing the operator to observe the sample live with the SEM during FIB milling to achieve the highest final lamella quality and end-pointing outcomes when thinner samples are required than what is provided by the automation. The company notes that its FIB column is extremely stable, and users report rarely needing to calibrate or align the system over multiple weeks, especially if it is working on routine processes. This dramatically reduces the operator effort, and the time spent setting up the tool prior to an automated run. The workflow is so robust that dozens The ZEISS Crossbeam 550 Samplefab FIB-SEM is optimized for fully automated preparation of TEM samples. The Excillum MetalJet series of x-ray sources are based on their unique metal-jet technology.
RkJQdWJsaXNoZXIy MTYyMzk3NQ==