edfas.org 45 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 1 DIRECTORY OF INDEPENDENT FA PROVIDERS Rosalinda M. Ring, NenoVision jmj4papa@yahoo.com Electronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. CT SEMICONDUCTOR Lé man Building 20 Truong Dinh, District 3 Ho Chi Minh City, Vietnam +84.962.687.387 info@ctsemiconductor.com ctsemiconductor.com Services Offered: ATP semiconductor chip technician training center, automated test equipment production services, ATE development services, burn-in, reliability qualifications services, and failure analysis services. Tools and Techniques: High temperature operating life test (HTOL), bias HAST, unbiased-HAST, thermal shock, preconditioning, temperature humidity bias (THB), highly accelerated temperature, humidity stress test (HAST), ESD (HBM, CDM, and air discharge), test plan development, load board design, change kit design, test program development, test program and device debugging, project management, product characterization, test limit evaluation, test time optimization, test cost reduction strategies, vector conversion, multi-site conversion, platform conversion, customized project development, final testing, wafer sorting, ball/lead scanning, post-test marking, tape and reel services, backing and dry packing, quality control systems, document management, data serving, yield analysis, binning, and statistical analysis. HI-REL LABORATORIES 6116 N Freya St Spokane, WA 99217 509.325.5800 hrlabs.com Services Offered: Specializes in the analysis and testing of microelectronics and materials technology. Tools and Techniques: Destructive physical analysis, failure analysis, materials analysis, counterfeit detection, real time x-ray, 3D CT x-ray/laminography, acoustic microscopy (SAM), FIB sectioning, SEM, EDS, FTIR, optical microscopy, prohibitive materials analysis (PMA), particle impact noise detection (PIND), hermeticity (fine and gross leak), delid/decap/laser ablation, visual inspection (internal and external), bond pull, die shear, color dot identification, infrared hot spot detection, cross section, physical dimensioning, energy dispersive x-ray fluorescence (EDXRF), wafer lot acceptance testing (WLAT), SEM qualification, precision metallographic examination, and laser induced breakdown spectroscopy (LIBS). INSCOPE LABS PTE. LTD. 11 Ubi Road 1, #07-01 Singapore 408723 +65.6779.3735 sales@inscopelabs.com inscopelabs.com/index.htm Services Offered: Electrical localization, material analysis, and sample preparation. Tools and Techniques: Scanning optical microscopy, multi-laser NIR scanning optical microscope: 1064 nm laser capable of electron-hole pair generation through backside silicon, 1340 nm laser (high resolution thermal probe which allows localized heating), multiple techniques available (e.g. VBA, TIVA, SDL), high power delivery 30 mW at DUT for all objectives including 100x, navigation camera for real time backside imaging to complement the slow scan rate of laser scan module, photon emission microscopy (high numerical aperture (NA), long working distance (WD), high sensitivity macro lens, high sensitivity detector (cooled CCD camera and InGaAs camera), real time backside imaging, SEM and energy dispersive x-ray spectroscopy (EDS) analysis, x-ray analysis, Sonix scanning acoustic microscope, sample preparation by mechanical polishing, chemical decapsulation, cross section with FIB, TEM sample preparations by mechanical polishing and FIB, and sputter coating of sample (Au or Cr).
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