edfas.org 31 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 1 ISTFA 2024 ORGANIZING COMMITTEE: General Chair - Yan Li, Samsung Vice General Chair - Renee Parente, AMD Technical Program Chair - Kristofor Dickson, NXP Tutorial & Short Course Chairs - Rosalinda Ring, NenoVision, and Wentao Qin, Microchip Panel Discussion Chairs - Ted Kolasa, Northrop Grumman, and Greg Johnson, Zeiss User Group Chairs - Daminda Dahanayaka, IBM, Joy Liao, Nvidia Corp., and Anita Madan, Independent Consultant Roadmap Chairs - Vinod Narang, AMD, and Keith Serrels, NXP Exposition Chairs - Sebastian Brand, Fraunhofer IMWS, and Chris Richardson, Allied High Tech Products Inc. Movie Chair - Peng Li, Intel Corp. AV Chairs - Erwin Hendarto, Silicon Labs, and Chuan Zhang, Nvidia International Chairs - Guillaume Bascoul, CNES – French Space Agency, and Bernice Zee, AMD University Chairs - Navid Asadi, University of Florida, and Vincent Immler, Oregon State University Local Arrangements Chair - Lesly Endrinal, Google Past Conference Chair - Frank Altmann, Fraunhofer IMWS ISTFA SPONSORS & SUPPORTERS On behalf of the Electronic Device Failure Analysis Society (EDFAS) and the organizers of ISTFA 2024, we appreciate your generous sponsorship contribution and recognize your continued commitment in making the ISTFA Conference and Exposition an outstanding event! Sponsors Allied High Tech Products Inc. BSET EQ Siemens EDA Thermo Fisher Scientific ULTRA TEC Zeiss Corporate Supporters Denton Vacuum DC – Digit Concept ESD Association JIACO Instruments Nanoscience Instruments Nisene Technology Group Inc. Media Sponsor EDFA Magazine PVA TePla Quartz SELA Synopsys Ted Pella Inc. Tescan
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