edfas.org 29 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 1 techniques reinvented for the backside power delivery network such as focused x-ray assisted device alteration and e-beam probing, were introduced. AI applications in defect detection and classification were also illustrated. “AI Applications in Failure Analysis” was the topic of the panel discussion chaired by Ted Kolasa from Northrop Grumman and Greg Johnson from Zeiss. Experts from both academia and industry talked about numerous AI applications in FI and FA, challenges, standard, as well as future development trends. A unique element of ISTFA, the six user groups (UG) fostered an interactive platform to discuss novel applications of FA techniques, challenges, and future development trends in the areas of focused ion beam, system in package, sample preparation, optical fault isolation, nano- probing, and AI applications. Thanks to Daminda Dahanayaka, IBM, Joy Liao, Nvidia, and Anita Madan, independent consultant, as well as UG session chairs, co-chairs, and panelists. The UG sessions were very well received. indispensable when pursuing subtle and elusive defects in microelectronics. A total of 79 companies presented their latest and greatest tools, techniques, and technical solutions to address the challenges in FI and FA of microelectronics. With 95 booths, the Expo promoted a platform for vendors to interact with users, receiving precious feedback for further improvement. It also provided a valuable opportunity for users to explore and visit many suppliers in one place. The student poster contest and the video contest on the Expo floor promoted more involvement from academia and tool vendors to creatively present their work. The dedicated efforts of Expo chairs Sebastian Brand, Fraunhofer IMWS, and Chris Richardson, Allied High Tech Products, movie chair, Peng Li, Intel Corp., and student poster contest chair, Ho Lun Chan from Virginia University, were highly appreciated. ISTFA is not only a technical conference, it also brings together a vibrant community. I would like to express my sincere gratitude to all the volunteers, session chairs, co-chairs, reviewers, and especially the ISTFA 2024 organizing committee and ASM International staff for their exceptional contributions. JOIN US AT ISTFA 2025 ISTFA 2024 was successful, fruitful, and unforgettable—confirmation that the essence of ISTFA continues to flourish. I am looking forward to ISTFA 2025, which has been scheduled from November 16 to 20 in Pasadena, Calif. Led by General Chair Renee Parente, the newly formed ISTFA 2025 organizing committee encourages you to consider volunteering and showcasing your original work at ISTFA 2025. Let us work together and make ISTFA 2025 marvelous! Colleagues socialized and networked during the luau event. James Chambers from Nvidia delivered the keynote to a packed audience. The FA Roadmap session hosted a keynote speech from Dr. Marla Dowell in CHIPS Metrology Program, followed by interactive panel discussions around the roadmap survey results from FI-FA tool vendors, and generated action plans for 2025. NIST’s vison and government funding opportunities in the FI and FA field were presented. The EDFAS FA technology roadmap was employed as a reference when funding new research projects. Special thanks to Vinod Narang, AMD, and Keith Serrels, NXP, as well as FA technology roadmap council chairs, co-chairs, and committee members for their diligent efforts. ISTFA EXPO The Expo at the ISTFA conference is always a significant event for attendees, because advanced tools are
RkJQdWJsaXNoZXIy MTYyMzk3NQ==