edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 27 NO. 1 2 Governments around the world are investing in their domestic semiconductor industries, and in some cases the ecosystem for packaging and assembly. The U.S. CHIPS and Science Act includes $52 billion in subsidies for domestic semiconductor research and manufacturing. An investment tax credit of 25% is offered for investments in semiconductor manufacturing and processing equipment. The purpose of the act is to: • Increase capacity in domestic manufacturing and emerging technologies (i.e., onshore semiconductor manufacturing) • Promote critical supply chain resilience • Strengthen the national capacity for manufacturing innovation, and expand workforce development efforts • Deliver important measurement and technology to semiconductor R&D needs U.S. CHIPS ACT FUNDING Much of the funding is targeted for semiconductor fabrication, but some is focused on the packaging and assembly. The U.S. Department of Commerce (DOC) will manage and support industry at large. The $39 billion incentive program provides direct funds as grants or loans to increase capacity. New advanced semiconductor node fabs have received the most attention, but legacy fabs and packaging will also be funded. Under the program, $39 billion in incentives has been allocated to invest in U.S. production of strategically important semiconductor chips, to assure a sufficient sustainable and secure supply of older- and current-generation chips for national security purposes and for critical manufacturing industries. There is an allocation of $11 billion to strengthen U.S. semiconductor R&D leadership to catalyze and capture the next set of critical technologies, applications, and industries. Funding of $2 billion for Department of Defense (DOD) Microelectronics Commons is targeted to establish a national network that will create direct pathways to commercialization for U.S. microelectronics researchers and designers from “lab to fab.” Workforce development initiatives underpin all programs. The National Advanced Packaging Manufacturing Program (NAPMP) has been allocated $2.5 billion. The focus is to strengthen semiconductor advanced test, assembly, and packaging capability in the domestic ecosystem. The NAPMP will make R&D investments that leverage existing areas of FEBRUARY 2025 | VOLUME 27 | ISSUE 1 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS GUEST EDITORIAL ELECTRONICS INDUSTRY GETS GOVERNMENT ATTENTION E. Jan Vardaman, TechSearch International Inc. jan@techsearchinc.com edfas.org (continued on page 25) PURPOSE: To provide a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers. Nicholas Antoniou Editor/KLA nicholas.antoniou@kla.com Joanne Miller Senior Editor Victoria Burt Managing Editor Allison Freeman Production Supervisor ASSOCIATE EDITORS Navid Asadi University of Florida Guillaume Bascoul CNES France Felix Beaudoin GlobalFoundries Michael R. Bruce Consultant Jiann Min Chin Advanced Micro Devices Singapore Michael DiBattista Varioscale Inc. Rosine Coq Germanicus Universitié de Caen Normandie Szu Huat Goh Qualcomm Jason Holm NIST Ted Kolasa Northrop Grumman Space Systems Joy Liao Nvidia Corp. Rosalinda M. Ring NenoVision Tom Schamp E-Space David Su Yi-Xiang Investment Co. Martin Versen University of Applied Sciences Rosenheim, Germany FOUNDING EDITORS Edward I. Cole, Jr. Sandia National Labs Lawrence C. Wagner LWSN Consulting Inc. GRAPHIC DESIGN Jan Nejedlik, jan@designbyj.com PRESS RELEASE SUBMISSIONS magazines@asminternational.org Electronic Device Failure Analysis™ (ISSN 1537-0755) is published quarterly by ASM International®, 9639 Kinsman Road, Materials Park, OH 44073; tel: 800.336.5152; website: edfas. org. Copyright © 2025 by ASM International. Receive Electronic Device Failure Analysis as part of your EDFAS membership. Non-member subscription rate is $175 U.S. per year. Authorization to photocopy items for internal or personal use, or the internal or personal use of specific clients, is granted by ASM International for libraries and other users registered with the Copyright Clearance Center (CCC) Transactional Reporting Service, provided that the base fee of $19 per article is paid directly to CCC, 222 Rosewood Drive, Danvers, MA 01923, USA. Electronic Device Failure Analysis is indexed or abstracted by Compendex, EBSCO, Gale, and ProQuest. Vardaman
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