edfas.org 51 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 4 ABOUT THE COVER All images are from the 2023 EDFAS Photo Contest. Images and captions have been edited from original submitted entries. Top left: An electrical overstress damage site consistent with high-speed, high-energy, on-state collector-emitter voltage transient. Photo by Serge Kozhokar, Hi-Rel Laboratories Inc., Second Place Winner, Black and White Images. Top middle: Phase segmentation in a superjunction MOSFET. Photo by Flavio Cognigni, Sapienza University of Rome, Third Place Winner, False Color Images. Top right: Metal shielding on a PTFE hose leaked due to ESD. Photo by Stephen Fasolino, McKinney Failure Analysis Lab, Second Place Winner, Color Images. Bottom left: Broken drill bit during PCBA manufacturing. Photo by Paul Cudmore, Hi-Rel Laboratories Inc., Second Place Winner, False Color. Bottom middle: Bursting with energy. Photo by Kevin Awai, Failure Analysis and Component Test (FACT) Dept., Third Place Winner, Color Images. Bottom right: Predjama, the Cave Castle. Photo by Paul John B. Sotto, Analog Devices General Trias Inc., Third Place Winner, Black and White Images.
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