edfas.org 45 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 4 Symbios Logic, LSI Corp., Abound Solar, and now Allied High Tech Products, where he is currently the x-prep product and applications manager. He received a M.S. in electrical engineering from the University of Colorado. Richardson’s volunteerism with EDFAS began in 2002 where he started as an ISTFA tutorial organizing committee member and has served as a technical reviewer as well as being part of the EDFAS Board as a Member-at-Large, and EDFAS Executive Board as Secretary. His technical contributions to the ISTFA community include tutorials: FIB – A Fault Isolation Design Repair Tool, Photovoltaic Failure Analysis, and Failure Analysis Workflow, as well as numerous technical papers. Vision Statement As I have traveled the world over the last ten years, I have had the opportunity to interface with many different failure analysis labs, and more increasingly, hardware forensic science labs. What I see is the need for the EDFAS organization to reach out beyond the semiconductor failure analysis world into organizations that are designing the packages and silicon. Our Society could help educate the designers on the challenges associated with failure analysis on these complex devices and possibly get consideration for design for failure analysis. As a community we could grow by helping these types of conferences with our knowledge to help accelerate their learning. The challenges that face our society and industry will benefit more from the synergistic relationships. Daminda Dahanayaka is a distinguished professional with a remarkable career in the semiconductor industry. Currently serving as the senior manager of semiconductor FAB operations at IBM Research within the Albany Nano-Technology Center, Dahanayaka is a passionate advocate for enhancing productivity and efficiency in semiconductor manufacturing while championing sustainable industry practices and embracing the principles of LEAN SIX Sigma. Dahanayaka’s influence extends beyond his daily responsibilities, and he has been an active contributor to the International Symposium of Failure Analysis (ISTFA) for over a decade. He has played various roles within ISTFA, including abstract reviewer, session chair, and organizing committee member. Vision Statement In my vision for the future, I see the EDFAS Board as a driving force, working tirelessly to: 1. Cultivate Emerging Talent: We should actively introduce and recruit young engineers and scientists to the realm of semiconductor analysis. Their fresh perspectives and innovative thinking are invaluable assets. 2. Foster Innovation: Innovation and invention hold immense potential in this field. We should promote and encourage creative thinking to drive advancements in semiconductor analysis techniques and technologies. 3. Facilitate Collaboration: Collaboration is key to success. We must encourage engineers from different companies to work together. Experienced EDFAS members can serve as mentors, bridging the gap between seasoned professionals and new talent. 4. Support Co-development: Collaboration should extend to co-development efforts involving FA engineers, academia, and vendors. This collaboration can lead to novel analytical techniques and equipment that benefit the entire industry. 5. Perform a Needs Assessment: EDFAS should actively gather information on the needs of FA engineers (FA roadmap initiative) and provide guidance to vendors. This ensures that development efforts are aligned with the practical requirements of the industry. 6. Explore Government Funding and the CHIPS Act Bill: EDFAS should represent the FA community in the projects initiated with CHIPS Act and guarantee that advancements in FA is considered. By embracing these principles and working together, we can propel the semiconductor industry forward, keep pace with evolving technologies, and meet the everincreasing demands of this dynamic field. EDFAS is poised to lead the way, fostering innovation, collaboration, and progress for all its members and the industry as a whole. Ted Kolasa received his MSEE from Arizona State University with a specialization in electromagnetics and microwave circuit design. He started his professional career in the aerospace industry, working as an RF systems engineer at Orbital Sciences Corp. before joining Motorola Semiconductor. At Motorola, he worked as a failure analysis engineer, specializing in root cause failure analysis of power, analog, and mixed-signal devices used in automotive, consumer, and cellular communication
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