edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 4 44 BOARD CANDIDATE PROFILES PROFILES OF CANDIDATES FOR THE EDFAS BOARD OF DIRECTORS James Demarest, FASM, Chair, EDFAS Awards & Nominations Committee jjdemar@us.ibm.com The EDFAS Board of Directors unanimously approved one vice president, one reappointed secretary, and three new members with terms beginning in 2024. Vice President 2024-2026 • Yan Li Secretary 2024-2026 • Chris Richardson (Reappointed) Members-At-Large 2024-2027 • Daminda Dahanayaka • Ted Kolasa • Vinod Narang Congratulations to these board members. Yan Li received her Ph.D. degree in materials science and engineering from Northwestern University in 2006, and her M.S. and B.S. degrees in physics from Peking University, China. After more than 17 years at Intel, focusing on advanced packaging technology developments, she joined Samsung Advanced Packaging group in San Jose as a principal engineer in 2023. Li has been an active member of TMS, IEEE, ASM International, and EDFAS. She has been appointed as an ISTFA conference organizer since 2011 and has been an EDFAS board member since 2019. Li has published over 20 papers and two patents in the microelectronic packaging area. She is the co-editor of three semiconductor industry highly recognized books on 3D microelectronic packaging and autonomous vehicles. Vision statement EDFAS is the society which can provide the diverse combination of electronic engineering, materials science and engineering, mechanical engineering, optics, physics, chemistry, computer science, along with a dedicated focus on electronic device failure analysis to scientists, engineers, and graduate students who perform failure analysis of advanced electronic devices. It provides a learning and sharing platform to professionals and graduate students working in this field. Meanwhile it also serves as a communication medium between semiconductor industry and tool vendors to develop innovative tools and techniques, expand FI-FA tool capability, and meet the industry demands. It works for the continuous improvement of technology, device performance, and reliability in semiconductor industry. Expanding the scope of EDFAS to emerging areas such as artificial intelligence, autonomous driving, Si photonics, and automation, can help our Society meet “Big Data” needs. Networking with other societies focusing on device testing, wafer or package processing, materials analysis, quality and reliability of devices, and modeling can equip our professionals with knowledge and backgrounds they need to provide well rounded and in-depth failure analysis, thus driving problem solving. Investing in graduate students and attracting academia interests in failure analysis techniques can foster talents and ensure a bright future for EDFAS. Chris Richardson has been working in the semiconductor and solar industries for 30 years in various roles, including electrical failure analysis, design circuit debug/ edit, analytical services, and failure analysis tool development. His failure analysis background was developed while working with various companies including, NCR,
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