edfas.org 43 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 4 SIEMENS BOOTH 401 TED PELLA INC. Ted Pella Inc. announces the PELCO Dimpler, which provides automated precision thinning of specimens for TEM analysis, for deprocessing and failure analysis, and similar applications where targeted fine polishing is required. It is a precision electro-mechanical metallographic lapping instrument that will continuously monitor and control dimpling parameters and accurately terminate at a preset specimen thickness. Active monitoring of the Z-position, feedback-controlled damping, and automated controls for determining termination of processing work together to provide repeatable, reliable results in sample preparation. tedpella.com/Material-Sciences_html/ PELCO-Dimpler.aspx BOOTH 200 ULTRA TEC ULTRA TEC’s ULTRAPOL Advance is the leading all-in-one lapping and polishing workstation for the production of flat surfaces. A combination of advanced control and process features allow for the accurate processing of modern of ICs through topside electronic de-processing— enabled by the advanced optical enhancements such as our ULTRACOLLIMATOR. Applications include backside preparation of packages and wafers, particularly for flipchips—and rapid global thinning of larger surfaces. The ULTRAPOL Advance offers crosssectioning of die and package-level devices. ultratecusa.com BOOTH 301 QUARTZ IMAGING CORP. Software for a FASTER SMARTER Lab! Featuring the Quartz LIMS family: • FA-LIMS: Laboratory information management system for failure analysis and materials characterization labs. Configured to your workflow & terminology requirements. • RE-LIMS: For reliability and quality assurance labs. Generate qual plans quickly, track all times and results, manage priorities and resources. • CH-LIMS: For chemical analysis labs. PCI-AM: Automated Measurement of Semiconductor Features— Three levels of single click automation. quartzimaging.com CARL ZEISS MICROSCOPY ZEISS meets the semiconductor industry’s challenges for next-generation devices by providing high-resolution microscopy solutions for failure analysis and characterization spanning wafer, die, and packaging applications. ZEISS offers a full range of SEM, FIB, optical, and x-ray microscopes. zeiss.com/semiconductor-microscopy BOOTH 601 BOOTH 507 Siemens’ Tessent yield learning software family leverages scan test data to uncover hidden yield limiters and to identify root cause of defect mechanisms. Failure analysis success rate is maximized while accelerating productivity of fault isolation effort. Machine learning is native to our toolset and is used to find trends across dies, wafers, and lots, thereby reducing risk of bad candidate selection. siemens.com/tessent-yield-learning ISTFA 2024 headquarter hotel and conference center.
RkJQdWJsaXNoZXIy MTYyMzk3NQ==