edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 4 2 There is so much to celebrate but first I’d like to thank those of you who started it all and set us on this long and fruitful path. ISTFA’s creation can be traced to a meeting held in 1975 in the basement of a TRW building. It lasted half a day, you had to bring your own lunch, and was attended mostly by IEEE Reliability Group folks. The reason they gave for having this meeting was captured in this statement: “FA is important to us; why is it hidden in dark rooms? Let’s talk about it.” The following year (1976) the meeting was already starting to look and feel like a conference. It lasted almost two days, was in a proper venue (Newport Beach Hotel), and had 20 formal papers and proceedings. They named this meeting ATFA (Advanced Techniques in FA). It was very much a local gathering, and the organizers came from TRW, Hughes Aircraft, Rockwell International, ITT Cannon, and the Aerospace Corp. The meeting lost money both years and IEEE lost interest. ATFA was created as a not-for-profit corporation by D. McCormac, Leon Hamiter, L. Kashar, Jim Richardson, and Bob Myers. This team changed the focus by bringing in exhibitors so attendees could try out equipment for FA, highlighting practical techniques and networking. In 1979, the name was changed to the International Symposium for Testing and Failure Analysis (ISTFA), participation increased, and it ran for three days with parallel sessions. Representatives from Japan, Europe, Africa, Taiwan, South Korea, India, Poland, Romania, and even Iran were involved. This was before the Berlin wall fell and before the Shah of Iran was overthrown. In 1986, ISTFA was transferred to ASM International where it has remained ever since. In 1998, largely due to the significant growth of FA interests and the microelectronics industry, ASM launched a new affiliate society, the Electronic Device Failure Analysis Society (EDFAS). ISTFA is the premiere event for EDFAS while still in the ASM family. ADVANCED FAILURE ANALYSIS TECHNIQUES FIRST ANNUAL SEMINAR An all-day seminar will be conducted on advanced techniques for failure analysis of state-of-the-art microelectronics, including semiconductors, thin and thick film hybrids, and joining and processing methods. This is the description of the first meeting held on January 18, 1975, of what was to become the International Symposium on Testing and Failure Analysis (ISTFA). A $6.00 charge for each attendee covered a steak lunch and refreshments during the breaks. NOVEMBER 2024 | VOLUME 26 | ISSUE 4 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS GUEST EDITORIAL CELEBRATING 50 YEARS OF ISTFA Nicholas Antoniou nicholas.antoniou@kla.com edfas.org (continued on page 39) PURPOSE: To provide a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers. Nicholas Antoniou Editor/KLA nicholas.antoniou@kla.com Mary Anne Fleming Director, Journals, Magazines & Digital Media Joanne Miller Senior Editor Victoria Burt Managing Editor Allison Freeman Production Supervisor ASSOCIATE EDITORS Navid Asadi University of Florida Guillaume Bascoul CNES France Felix Beaudoin GlobalFoundries Michael R. Bruce Consultant Jiann Min Chin Advanced Micro Devices Singapore Edward I. Cole, Jr. Sandia National Labs Michael DiBattista Varioscale Inc. Rosine Coq Germanicus Universitié de Caen Normandie Szu Huat Goh Qualcomm Ted Kolasa Northrop Grumman Space Systems Rosalinda M. Ring NenoVision Tom Schamp Materials Analytical Services LLC David Su Yi-Xiang Investment Co. Martin Versen University of Applied Sciences Rosenheim, Germany FOUNDING EDITORS Edward I. Cole, Jr. Sandia National Labs Lawrence C. Wagner LWSN Consulting Inc. GRAPHIC DESIGN Jan Nejedlik, jan@designbyj.com PRESS RELEASE SUBMISSIONS magazines@asminternational.org Electronic Device Failure Analysis™ (ISSN 1537-0755) is published quarterly by ASM International®, 9639 Kinsman Road, Materials Park, OH 44073; tel: 800.336.5152; website: edfas. org. Copyright © 2024 by ASM International. Receive Electronic Device Failure Analysis as part of your EDFAS membership. Non-member subscription rate is $175 U.S. per year. Authorization to photocopy items for internal or personal use, or the internal or personal use of specific clients, is granted by ASM International for libraries and other users registered with the Copyright Clearance Center (CCC) Transactional Reporting Service, provided that the base fee of $19 per article is paid directly to CCC, 222 Rosewood Drive, Danvers, MA 01923, USA. Electronic Device Failure Analysis is indexed or abstracted by Compendex, EBSCO, Gale, and ProQuest. Antoniou
RkJQdWJsaXNoZXIy MTYyMzk3NQ==