edfas.org 19 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 4 3D XRM provides superior 3D image quality and data with high resolution and contrast for a wide range of materials and working environments where 2D scans are no longer sufficient. Its ability to achieve high resolution at long working distances extends nondestructive imaging to large samples and allows for 4D and in situ studies. A novel correlative workflow using 3D XRM and an integrated fs-laser FIB-SEM allows for precise wire cutting without damaging neighboring wires or the die, preserving the sample integrity for further testing. Both use cases demonstrated reduced overall analysis time and highlighted the throughput and precision capabilities of streamlined workflows, which present new capabilities in the fault isolation and failure analysis of advanced packages. Workflows using 3D XRM to guide laser-integrated FIB-SEM instruments in combination with AI training models have great potential to accelerate nondestructive fault detection for the densely packed interconnects used in complex heterogeneous computing environments and chiplet-based architectures. REFERENCES 1. J. Walraven, et al.: Sandia Report 2023-11278 - Heterogeneous Integration Failure Analysis (HIFA) Technology Roadmap for 2.5D/3D Devices, 2023. 2. EDFAS Electronic Device Failure Analysis Technology Roadmap (2023). Retrieved from https://dl.asminternational.org/technical-books/ monograph/193/Electronic-Device-Failure-Analysis-Technology. 3. C. Hartfield, et al.: “Emerging Technologies for Advanced 3D Package Characterization to Enable the More-than-Moore Era,” ECS Transactions, 2022, 109(2), p. 15-29, doi.org/10.1149/10902.0015ecst. 4. “Resolution of a 3D X-ray Microscope: Defining Meaningful Resolution Parameters,” Zeiss Technical Note, 2019, retrieved from: https://zeiss.widen.net/s/hl2mmqwkvr/en_tech-note_3d-xrmresolution_semiconductor-us. 5. MAPT - Microelectronics and Advanced Packaging Technologies Roadmap, Semiconductor Research Corp., 2023, Chapter 7, p. 143, retrieved from https://srcmapt.org/wp-content/uploads/2023/10/ SRC-MAPT-Roadmap-2023.pdf. 6. D. Taraci: “A Novel 2D/3D X-ray Microscopy Alignment and Inspection Solution for Thermocompression Bonding (TCB) in a Highly Integrated Flip Chip Fan-Out Wafer Level Package (FO-WLP),” iMAPS 2023, International Microelectronics & Packaging Society. 7. V. Viswanathan: “Targeted Sample Preparation and Analysis of Advanced Packaging using Correlated X-ray Microscopy and Laser FIB,” CPMT Symposium Japan 2022, IEEE. ABOUT THE AUTHOR Cheryl Hartfield is ZEISS North America Product Marketing Manager for FIB-SEM and 3D XRM in electronics. She was Senior Member of Technical Staff at Texas Instruments and worked for 12 years in materials characterization and package development. A co-founder of Omniprobe, Hartfield also innovated TEM sample preparation. She has B.S. and M.S. degrees in microbiology from Texas A&M and UT Southwestern Graduate School of Biomedical Sciences. Hartfield is an ASM Fellow, past president of EDFAS, and former ISTFA general chair. She received the EDFAS President’s Award for exceptional service to the Society. She holds 15 patents and has published more than 70 papers and book chapters. NOTEWORTHY NEWS NANOTS 2024 The 44th annual NANO Testing Symposium (NANOTS 2024) will be held November 12-14 at Senri Life-Science Center, in Toyonaka, Osaka, Japan. NANOTS is one of the leading technical symposiums for discussing solutions that improve the testing process of nanoscale devices and materials. NANOTS is sponsored by the Institute of NANO Testing in cooperation with the Institute of Electronics, Information and Communication Engineers, the Japan Society of Applied Physics, the Reliability Engineering Association of Japan, and the Union of Japanese Scientists and Engineers. For more information, visit the NANOTS website at https://inanot.sakura.ne.jp/nanots.
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