edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 4 ABOUT THE COVER See page 51 for a description of the contest images collage on the cover. A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS NOVEMBER 2024 | VOLUME 26 | ISSUE 4 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS Electronically Viable TEM Samples with PFIB and STEM EBIC William A. Hubbard Scanning TEM electron beam-induced current (STEM EBIC) imaging is a promising technique for providing high-resolution electronic and thermal contrast as a complement to TEM’s physical contrast. DEPARTMENTS Four-dimensional Scanning Transmission Electron Microscopy: Part III, Ptychography Aaron C. Johnston-Peck and Andrew A. Herzing The final part of this series covers ptychography, a form of computational imaging that recovers the phase information imparted to an electron beam as it interacts with a specimen. Author Guidelines Author guidelines and a sample article are available at edfas. org. Potential authors should consult the guidelines for useful information prior to manuscript preparation. 2 4 2 GUEST EDITORIAL Nicholas Antoniou 36 EDFAS AWARDS 38 ASM AWARDS 40 CALL FOR PAPERS 41 ISTFA 2024 EXHIBITORS LIST 42 ISTFA 2024 EXHIBITOR SHOWCASE 44 BOARD CANDIDATE PROFILES James Demarest 48 DIRECTORY OF FA PROVIDERS Rosalinda Ring 50 EDUCATION NEWS Navid Asadi 51 ABOUT THE COVER 52 PRODUCT NEWS Ted Kolasa 54 TRAINING CALENDAR Rosalinda Ring 56 ADVERTISERS INDEX Nondestructive 3D X-ray Microscopy Speeds Throughput in New Failure Analysis Workflows Cheryl Hartfield This article shows the application of 3D XRM to nondestructively detect non-optimized assembly processes that can influence local stresses and overall device reliability, making it useful for process development as well as FA. 14 For the digital edition, log in to edfas.org, click on the “News & Magazines” tab, and select “EDFA Magazine.” Celebrating 50 Years of ISTFA Nicholas Antoniou A look back at ISTFA over the years from the first gathering in 1975. 14 4 27 Precise Final Specimen Thinning by Concentrated Argon Ion Beam Milling of Plan View TEM Specimens C.S. Bonifacio, Y. Yu, M.L. Ray, M. Skowronski, and P.E. Fischione Xenon plasma focused ion beam specimen preparation is ideal for preparing plan view TEM specimens due to its large-volume-milling capabilities. 20 27 20
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