edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 3 52 Allied High Tech................................................ 26-27 ASM International..........................Inside front cover Checkpoint Technologies................................. 12-13 Optotherm Inc.........................................................43 Quantum Focus.........................................................3 Ted Pella..................................................................51 ULTRA TEC.................................................Back cover For advertising information and rates, contact: KJ Johanns, Business Development Manager 440.671.3851, kj.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/advertise. INDEX OF ADVERTISERS A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS Whether networking at events or accessing information through EDFA, ISTFA proceedings, or journals, our members have the edge. Now it’s time to introduce EDFAS to others in the industry who would like to take advantage of these career-enhancing benefits. Help us help the industry by expanding our membership and offering others the same exceptional access to information and networking that sets EDFAS apart. To reacquaint yourself with and introduce others to the EDFAS member benefits, visit asminternational.org/edfas/membership. EDFAS MEMBERSHIP IN MEMORIAM David Lewis Burgess, 83, of Santa Clara, California, passed away on March 31. Born on November 30, 1940, Burgess graduated from Edward Little High School in Auburn, Maine, and received further education at Rensselaer Polytechnic Institute, San Jose State College, and Stanford University. His first job was at Lockheed Missiles & Space Company. During his 60-year semiconductor career, Burgess was employed at several major companies, most notably Fairchild Semiconductor and Hewlett-Packard Company where he was the corporate reliability physicist. In later years, he taught seminars in semiconductor failure analysis worldwide. This Burgess led him to form a small company, Accelerated Analysis, which provided specialty tools and chemicals for use in semiconductor failure analysis. Burgess was a senior life member of IEEE and a life member of both EOS/ESD and ASM International. He was also an active member of ASM’s Electronic Device Failure Analysis Society (EDFAS) and a longtime attendee of ISTFA, accompanied by his wife Marion. Burgess received the 2023 EDFAS President’s Award in honor of his dedication and exceptional service to the failure analysis community. He held two patents related to failure analysis of semiconductor devices, wrote and contributed to several books, and presented papers at the International Reliability Physics Symposium, where he served as chairman in 1983. Burgess wrote extensively over the years for EDFA magazine, including championing the Master FA Techniques department and serving as associate editor from 2016 to 2023. Advertise in Electronic Device Failure Analysis magazine!
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