edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 3 48 TRAINING CALENDAR LIFELONG LEARNING EDFAS believes in lifelong learning and supporting our members and customers in that endeavor. Our goal is to provide a list of educational resources in failure analysis and related topics in each issue of EDFA magazine. In addition, explore all EDFAS has to offer from regional events, chapter courses, and tutorials and courses during ISTFA. Find out more by visiting edfas.org. Rosalinda M. Ring, NenoVision jmj4papa@yahoo.com EVENT DATE LOCATION How to Organize and Run a Failure Investigation 8/5-6 Virtual event Corrosion 8/5-8 Novelty, OH Practical Fracture Mechanics 8/6-7 Novelty, OH Metallographic Techniques 8/12-15 Novelty, OH Principles of Failure Analysis 8/19-21 Virtual event Scanning Electron Microscopy 8/23 Novelty, OH Contact: ASM International Semiconductor Reliability and Product Qualification 8/5-8 Virtual Event Advanced CMOS/ FinFET Fabrication 8/19-22 Virtual Event IC Packaging Technology Webinar 8/26-29 Virtual Event Contact: Semitracks Inc. International Conference on Electronic Packaging Technology 8/7-9 Tianjin, China Contact: ICEPT HOTCHIPS 2024 8/24-27 Stanford, CA Contact: HOTCHIPS August 2024 EVENT DATE LOCATION Practical Fractography 9/9-10 Novelty, OH Advanced Metallographic Techniques 9/16-19 Novelty, OH Component Failure Analysis 9/16-19 Novelty, OH Component Failure Analysis 9/16-19 Virtual Event Contact: ASM International AI Hardware and Edge AI Summit 9/9-12 San Jose, CA Contact: AI Hardware and Edge AI Summit Design and Verification Conference (DVCon) 9/10-11 Hsinchu, Taiwan Contact: DVCon Managing EMI and Electrical Overstress in Semiconductor Manufacturing and PCBA 9/19 Milpitas, CA Navigating the Legal Landscape: AI Litigation Risks in Semiconductor and Medtech 9/25 Virtual Event Contact: SEMI European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) 9/23-26 Parma, Italy Contact: ESREF International Microelectronics and Packaging Society (IMAPS) Symposium 9/30-10/3 Boston, MA Contact: IMAPS September 2024 (cont'd) EVENT DATE LOCATION Advanced CMOS/ FinFET Fabrication 9/2-3 Singapore Packaging Failure and Yield Analysis 9/9-10 Penang, Malaysia Packaging Failure and Yield Analysis 9/23-24 Manila, Philippines Contact: Semitracks Inc. September 2024
RkJQdWJsaXNoZXIy MTYyMzk3NQ==