Aug 2024_EDFA_Digital

edfas.org 43 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 3 sample preparation, decapsulation, die exposure, deprocessing, emission microscopy, design support, sample preparation, mechanical probing, real time x-ray, SAM, and SEM/EDS. PHOENIX NATIONAL LABORATORIES LLC 941 S. Park Ln. Tempe, AZ 85281 602.431.8887 pnltest@pnltest.com pnltest.com Services Offered: Quality testing, inspection, and engineering services. Tools and Techniques: Failure analysis, field replications for creep analysis, macro and micro examinations, hardness testing, and optical microscopy. SAGE ANALYTICAL LABS 5744 Pacific Center Blvd., Suite 302 San Diego, CA 92121 858.255.8587 www.sagefalab.com Services Offered: ESD CDM failure analysis testing, IC failure analysis testing, PCB reverse engineering, and IC process consultation. Tools and Techniques: Particle sizing by dynamic light scattering (DLS), 3D CT sub-micron x-ray analysis, highresolution IC photo navigation, Orion2 HD tester by Fisher Scientific, Helios NanoLab 660 Dual-Beam FIB, SEM, OptiFIB-IV Focused Ion-Beam, QFI Thermal Emissions Microscopy, IR, XIVA, TIVA, OBIRCh analysis, Omniprobe AutoProbe 200, JetEtch Pro CuProtect System, high pin count automatic curve tracing and characterization, 3D x-ray inspection, destructive physical analysis (DPA), delamination, CSAM analysis, counterfeit analysis, backside IC editing services, and electrical characterization. SEMTEC LABORATORIES INC. 5025 S. 33rd St. Phoenix, AZ 85040 edsworth@aol.com azernot@aol.com 602.276.6138 semteclaboratories.com Services Offered: Comprehensive, high-resolution forensic and failure analyses. Tools and Techniques: SEM, field emission SEM (FeSEM), EDS, digital x-ray imaging, micro-hardness testing, crosssectioning, and de-encapsulation services.

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