edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 3 42 DIRECTORY OF INDEPENDENT FA PROVIDERS Rosalinda M. Ring, NenoVision jmj4papa@yahoo.com Electronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. ADVANCED CIRCUIT ENGINEERS 308 S. Abbott Ave. Milpitas, CA 95035 408.719.1617 sales@advancedcircuitengineers.com www.advancedcircuitengineers.com Services Offered: Advanced level FIB circuit editing, dual-beam (FIB-SEM) imaging and atomic resolution TEM analytical services. Tools and Techniques: FIB circuit edit, TEM–STEM, EDX, EELS, dual-beam, and FIB cross-section. DECAPLAB San Diego, CA decaplab.com Services Offered: IC package decapsulation. Tools and Techniques: Laser, wet, and dry decapsulation techniques. EBATCO 10025 Valley View Rd., Suite 150 Eden Prairie, MN 55344 952.941.2199 866.832.2826 info@ebatco.com ebatco.com Services Offered: Nano analytical and testing (NAT) laboratory services. Tools and Techniques: Nanoindentation, nano hardness, elastic modulus, toughness, hardness and modulus mapping, tensile and compressive yield strength, nano/ micro scratch, interfacial adhesion, metallurgy, metallography, SEM, EDS, XRD, failure and root cause analysis, abrasion, wear, friction coefficient, lubricity, AFM, EFM, MFM, SPM, surface roughness, optical profilometry, nano/ micro particle size analysis, zeta potential of nano/micro particles, zeta potential of solid surfaces, membranes, nano/micro pore size measurement, contact angles, advancing/receding angles, powder contact angles, sliding angle/roll off angle, micro contact angle of wires, fibers, micro-features, surface free energy analysis, liquid surface/interfacial tension, CMC, liquid density, viscosity, refractive index, turbidity, thermal analysis, DMA, DSC, TGA, TMA, STA, FTIR spectroscopy/microscopy, confocal Raman spectroscopy/microscopy, peel strength measurement, measurements with temperature controls, trace element analysis through ICP-OES, color, gloss, and rub test of prints and paint coatings. EFI SERVICES LTD. Egry József u. 18., 1111 Budapest, Hungary +36.1.463.4268 info@efi-labs.com www.efi-labs.com Services Offered: Failure analysis, validation tests of components, products, and technologies, Ipc-A-610 based product evaluation, consultation on analysis reports, interpretation of 8D reports, production failure analysis, field failure analysis, support of NPI or NTI optimization and qualification, consultation on equipment purchase, and training. Tools and Techniques: Optical microscopy, x-ray microscopy, cross-sectioning, BGA dye and pry test, shear test, SEM, FT-IR, XRF, SAM, and decapsulation. FA INSTRUMENTS INC. 36217 Worthing Dr. Newark, CA 94560 510.851.5555 info@fainstruments.com jim@fainstruments.com www.fainstruments.com/Service.htm Services Offered: IC failure analysis and consulting. Tools and Techniques: Frontside photoemission microscopy, Moire thermal imaging, FMI, backside photoemission microscopy, stimulus induced fault testing (SIFT), time of flight SIFT (available for development and licensing). MICROTECH LABORATORIES LLC 538 Haggard St., Suite 402 Plano, TX 75074 972.633.1533 contact@micro-labs.com microtechlaboratories.com Services Offered: Failure analysis, component analysis, PCBA analysis, design debug, reverse engineering, constructions analysis, training, and consultation. Tools and Techniques: FIB, SEM, EDX, PEM/EMMI, liquid crystal, x-ray, SAM, decapsulation, cross-section, backside
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