edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 3 40 The EDFAS Education Subcommittee strives for the development and delivery of educational products to the EDFAS membership. Keeping with its strategic focus on reaching a broader audience, including facilitating Q&A and educational exchanges on the ASM Connect platform, the Subcommittee presents short format videos on selected FA topics. These presentations are available on ASM Connect in the EDFAS online community. Use the following link: https://bit.ly/3Vx37Bi. An ASM Connect login is required. For this issue, we are highlighting a tutorial by Jim Colvin on advanced physical sample preparation for failure analysis. In this video, Colvin discusses physical sample preparation. Given the continuous technological advancements in semiconductor devices and packaging styles, along with the development of optical, electronic, and beam-based tools and techniques for testing and assurance, sample preparation has become more crucial than ever—and less understood. Colvin details backside decapsulation, thinning, and polishing for standard components for producing optimized samples for photonemission microscopy and on down to singledigit remaining silicon requirements for the latest optical techniques. The tutorial also covers stacked die profiling and more esoteric applications for in-situ probing as part of the processing operation. For additional information on the EDFAS Education Subcommittee, contact Sue Sellers at sue.sellers@asminternational.org. EDUCATION NEWS Bhanu P. Sood bp.sood@gmail.com SPOTLIGHT ON TUTORIALS Fig. 1 The left side shows an RST contour mesh model of the part on the right. Fig. 2 RST mesh model shows final desired thickness.
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