edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 3 36 The FA Technology Roadmap session in 2024 will host a keynote speech from a senior leader in the CHIPS Metrology Program, followed by interactive discussions around the Roadmap survey results from FI-FA tool vendors, and generate action plans for 2025. “AI Applications in Failure Analysis” is the topic of the 2024 panel discussion. Experts from both academia and industry are going to talk about numerous AI applications in FI and FA, challenges, standards, as well as future development trends. The interactive discussions between the audience and the panel will generate creative ideas in AI applications. Being the core of ISTFA, the 2024 technical program has more than 20 oral and poster sessions, including the ever growing “AI Applications for Failure Analysis” session, a new session, “More than Moore: Si Photonics, Magnetics, Magneto Optics,” and all the sessions from 2023. In addition to being published in the indexed ISTFA conference proceedings, authors are encouraged to submit their manuscripts to a special issue of the ASM’s Journal of Failure Analysis and Prevention. The tutorial program features AI applications in the semiconductor industry and will include instructional lectures on fault isolation, microscopy, package, and physical failure analysis. Additionally, the education short courses that traditionally run on the day before ISTFA as a kickoff to the conference, allow participants to learn greater insights into key topics such as beam-based defect localization or failure analysis of electronic devices. The user groups (UG) are one of the key elements of ISTFA, providing an interactive forum to discuss best practices, current problems, and future trends in failure analysis, closely aligned to the EDFAS roadmap. The AI UG, focusing on standardized and AI-enhanced FA workflows, received lots of attention in 2023 and will continue to be a highlight in 2024. To encourage academia and student participation in ISTFA, the poster contest and the video contest will promote more involvement from local universities. Interesting topics and exciting results could be presented from a novel and fresh view. The Expo, a very important fixture of ISTFA, will showcase the latest and greatest tools and techniques relevant to the failure analysis field. More than 50 exhibitors have already signed up for the 2024 expo. Refreshments will be served in the expo area, providing a great place for attendees to reconnect with colleagues and make new connections, while visiting the expo booths and browsing the posters. Come to share your experiences, advance the industry and your career at the golden anniversary of ISTFA, the premier event for the microelectronics failure analysis community. I look forward to welcoming you to San Diego this October. ISTFA 2024 TECHNICAL SESSIONS Symposium sessions will be packed with high quality, innovative, and original unpublished pre- sentations: • New: More than Moore: Si Photonics, Magnetics, Magneto Optics, and Bitter Methods • AI Applications for Failure Analysis • Emerging FA Techniques and Concepts • Power Devices (Si, SiC, GaN) • Die Level Fault Isolation • Package Level Fault Isolation • Packaging and Assembly • System in Package and 3D Devices • Boards and Systems • FIB Circuit Edit • FIB Sample Preparation • Sample Preparation and Device Deprocessing • Microscopy Analysis and Materials Characterization • Case Studies: Device Analysis • Case Studies: FA Process and Workflows • Nanoprobing and Electrical Characterization • Scanning Probe Analysis • Product Yield, Test, and Diagnostics • Hardware Security and Counterfeiting • EOS/ESD Balboa Park Museum.
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