edfas.org 35 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 3 ISTFA 2024 PREVIEW: 50TH ANNIVERSARY ISTFA 2024 Yan Li, ISTFA 2024 Conference Chair Samsung yan.a.li@samsung.com The International Symposium for Testing and Failure Analysis (ISTFA) celebrates its golden anniversary in San Diego, California, from October 28 to November 1 with the theme of “Riding the Wave of Artificial Intelligence.” Artificial intelligence (AI) is revolutionarily changing the world, and profoundly reshaping the semiconductor industry. On one hand, the application of AI-based methodologies in silicon fabrication and advanced packaging areas, such as 3D chip co-design, wafer level process simulation and monitoring, product yield enhancement and reliability assurance, as well as microelectronic device failure analysis, can dramatically improve efficiency with a much lower cost. On the other hand, the exponentially increasing AI training parameters lead to ever bigger and complicated microelectronic devices with ever smaller transistors and interconnects, which requires more stringent quality and reliability standards, and poses tremendous challenges in fault isolation (FI) and failure analysis (FA). Understanding and resolving the new failures appeared during AI training, developing new tools and techniques to address FI and FA challenges, as well as innovatively integrating AI in FI-FA flow become crucial for new technology development and high-volume mass production in the semiconductor industry. Dr. James Chambers, vice president of Silicon Engineering and Sourcing at Nvidia, will present a keynote speech on generative AI and its implications to quality, reliability, and failure analysis. He will explore the types of latent defects that cause generative AI workloads to fail, their impact on FI and FA techniques and methodologies, as well as future technology development insights. ISTFA 2024 headquarter hotel and conference center.
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