edfas.org 17 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 3 inspection modalities, thereby offering a comprehensive approach to IC package validation. The advantages of implementing DFI are readily apparent. Primarily, it significantly reduces the likelihood of producing components that are challenging to validate or analyze for failures. This proactive approach has two key positive outcomes. First, it enhances reliability testing, enabling more effective identification and mitigation of potential failure points in the IC packages. Second, it leads to improved and expedited failure analysis capabilities, which is critical in the fast-paced semiconductor industry. The development of the DFI framework (Fig. 5) is structured around three major directions: Metrology and Database Development: This aspect aligns with some of the grand challenges outlined by the National Institute of Standards and Technology (NIST). It involves developing precise measurement methods to ensure that material and structural specifications and standards are met in advanced package manufacturing. Additionally, creating a comprehensive defects database for different feature units in a package is essential for the quick and reliable identification of defects. Automated FA Tools with AI Integration: The second direction focuses on building automated failure analysis tools that incorporate AI-based models. These tools, powered by robust database infrastructure, facilitate faster and more accurate classification of feature defects. The Fig. 5 The proposed design-for-inspection framework encompassing the three major directions. Fig. 4 The trend in x-ray resolution advancement and advanced node technology progress.
RkJQdWJsaXNoZXIy MTYyMzk3NQ==