edfas.org 11 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 3 Timo Bernthaler studied materials and surface engineering at Aalen University and received his Ph.D. from the School of Materials Science and Engineering at the University of New South Wales. He has worked for over 20 years in the development and characterization of structural and functional materials. In 2019, he became managing director of Matworks GmbH Materials Engineering Solutions—a company within the Steinbeis Enterprise for industrial technology transfer. Daniel Braun works for BMW AG as a failure analysis specialist. He is the technical group leader for semiconductor failure analysis in the Materials and Process Analysis division. Braun pursued his Ph.D. at the Karlsruhe Institute of Technology in the field of tribology. He received a master’s degree in material sciences from Friedrich-Alexander-University in Erlangen-Nürnberg. Stephan Diez works as a failure analysis specialist for BMW AG. He has been technical group leader for failure analysis in the field of general automotive electrics/electronics at the Materials and Process Analysis division for several years. Gerhard Schneider is director of the Materials Research Institute, Aalen University, and a co-opted professor in the Faculty of Mechanical Engineering at the Karlsruhe Institute of Technology (KIT). He conducts research in the fields of materials analysis, functional materials, additive manufacturing, and machine learning. ESREF 2024 The 35th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2024) will take place September 23-26 at the Paganini congress in Parma, Italy. This international symposium has a focus on reliability in all aspects of electronics including new applications in extremely harsh environments such as space, transport, energy conversion, and smart functions. It provides the leading European forum for developing all aspects of reliability management and innovative analysis techniques for present and emerging semiconductor applications. For more information, visit esref2024.org. ITC 2024 The International Test Conference (ITC) will be held November 3-8 in San Diego, Calif. ITC is the world’s premier conference dedicated to the electronic test of devices, boards, and systems covering the complete cycle from design verification, test, diagnosis, failure analysis, and back to process and design improvement. At ITC, test and design professionals will confront the challenges the industry faces and learn how these issues are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers. ITC, the cornerstone of TestWeek events, offers a wide variety of technical activities targeted at test and design theoreticians and practitioners. The conference includes paper sessions, keynotes, tutorials, case studies, commercial exhibits and presentations, and a host of ancillary professional meetings. ITC is sponsored by the IEEE. For more information, visit itctestweek.org. NOTEWORTHY NEWS
RkJQdWJsaXNoZXIy MTYyMzk3NQ==