edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 3 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS AUGUST 2024 | VOLUME 26 | ISSUE 3 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS DEPARTMENTS Assessing Compatibility of Advanced IC Packages to X-ray Based Physical Inspection M. Shafkat M. Khan, Chengjie Xi, Nitin Varshney, Aslam A. Khan, Hamed Dalir, and Navid Asadizanjani This article proposes development of a novel metric designed to furnish chip designers with a prognostic tool for x-ray imaging in the pre-silicon stage. Author Guidelines Author guidelines and a sample article are available at edfas. org. Potential authors should consult the guidelines for useful information prior to manuscript preparation. 4 14 2 GUEST EDITORIAL James Chambers 35 SPECIAL ISTFA 2024 PREVIEW Yan Li 37 ISTFA EXHIBITORS LIST 38 2024 PHOTO CONTEST 39 2024 VIDEO CONTEST 40 EDUCATION NEWS Bhanu Sood 41 INTERNET RESOURCES Rosalinda Ring 42 DIRECTORY OF FA PROVIDERS Rosalinda Ring 44 LITERATURE REVIEW Michael R. Bruce 46 PRODUCT NEWS Ted Kolasa 48 TRAINING CALENDAR Rosalinda Ring 50 GUEST COLUMN Lun Chan 52 IN MEMORIAM 52 ADVERTISERS INDEX Reliability and Optimization of Wire Bonding in Power Microelectronic Devices Norelislam El Hami, Aicha Koulou, and Abdelkhalak El Hami A numerical investigation of the probabilistic approach in estimating the reliability of wire bonding is presented along with a reliability-based design optimization methodology (RBDO) for microelectronic devices structures. 28 For the digital edition, log in to edfas.org, click on the “News & Magazines” tab, and select “EDFA Magazine.” Nondestructive Defect Detection in 3D X-ray Microscopy Data of Ball Grid Array Solder for Void Detection in Solder Joints using Deep Learning Kishansinh Rathod, Sankeerth Desapogu, Andreas Jansche, Timo Bernthaler, Daniel Braun, Stephan Diez, and Gerhard Schneider A deep learning-based nondestructive approach for void segmentation in BGA solder balls using 3D x-ray microscopy is presented. 14 4 28 ABOUT THE COVER “Cake-all-around.” False-color 3D rendering of a FIB-SEM tomography dataset acquired from a gate-all-around test structure. The visualization was virtually cut open to gain insight into the internal structure of the sample. Photo by Heiko Stegmann, Carl Zeiss Microscopy GmbH, First Place Winner in False Color Images, 2023 EDFAS Photo Contest.
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