edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 2 48 With the new Advanced Automation package, powerful recipes or workflows can be created to automate at different locations in the stage. The new software package ensures that measurements are made with consistent best-known practices while also improving efficiency and usability. For more information, visit afm.oxinst.com. HIGH-CAPACITY 12 nm-CLASS 32Gb DDR5 DRAM IS IDEAL FOR THE AI ERA Samsung Electronics Co. Ltd. claims to have the industry’s first and highest-capacity 32-gigabit (Gb) DDR5 DRAM using 12 nm-class process technology. This achievement comes after Samsung began mass production of its 12 nm-class 16Gb DDR5 DRAM in May 2023. It solidifies Samsung’s leadership in next-generation DRAM technology and signals the next chapter of high-capacity memory. “With the 12 nm-class 32Gb DRAM, we have secured a solution that will enable DRAM modules of up to 1-terabyte, allowing us to be ideally positioned to serve the growing need for high-capacity DRAM in the era of artificial intelligence and big data,” says SangJoon Hwang, executive vice president of DRAM Product & Technology at Samsung Electronics. EPOXY WITH HIGH GLASS TRANSITION TEMPERATURE MEETS NASA LOW OUTGASSING SPECS Master Bond EP17HTDA-2 is a one-component epoxy that can be used for bonding, sealing, and die attachment. It is not premixed and frozen, and cures with heat. This dimensionally stable system features excellent mechanical properties with both a high modulus and die shear strength. It transfers heat and resists thermo-mechanical stresses effectively. EP17HTDA-2 has exceptional temperature resistance with a service temperature range of -62°C to +316°C and a Tg of 185 to 190°C. This compound has a thermal conductivity of 1.30 to 1.44 W/(m·K), a low coefficient of thermal expansion, and is also electrically insulative with a volume resistivity greater than 1015 ohm-cm. It withstands a variety of chemicals including acids, bases, salts, fuels, oils, water, and many solvents. While EP17HTDA-2 is well suited for electronic and related applications, it can also be used in vacuum situations as it passes NASA low outgassing testing. It is a thixotropic paste, yet is available in 10 cc and 30 cc syringes for automated dispensing, and has a shelf life of 3 to 6 months when stored at 40 to 50°F. For more information, visit masterbond.com. Samsung’s newest memory product boasts the industry’s highest capacity for a single DRAM chip and offers double the capacity of 16Gb DDR5 DRAM in the same package size. Previously, DDR5 128GB DRAM modules manufactured using 16Gb DRAM required the through silicon via (TSV) process. However, by using Samsung’s 32Gb DRAM, the 128GB module can now be produced without the TSV process, while reducing power consumption by approximately 10% compared to 128GB modules with 16Gb DRAM. This technological breakthrough makes the product the optimal solution for enterprises that emphasize power efficiency, such as data centers. For more information, visit semiconductor.samsung. com. Samsung DDR5 32Gb DRAM. Master Bond EP17HTDA-2 epoxy meets NASA low outgassing requirements.
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