edfas.org 45 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 2 Services Offered: Test services, inspection and analysis, device/electronics analytical services, failure analysis, reverse engineering, IP analysis/litigation support, and teardown services. Tools and Techniques: Scanning acoustic microscopy, dual-beam FIB, scanning electron microscopy, systemlevel test, MIL-STD-883, wafer testing, electrical testing, radiation testing, and XRF analysis. WHITE HORSE LABORATORIES INDEPENDENT TEST LABORATORIES Lindberghstraße 12 82178 Puchheim, Germany +49.89.541.973.12 info@whitehorselabs.com whitehorselabs.com/our-locations/ White Horse Laboratories 29260 Clemens Road Westlake, OH 44145, USA 833.856.2360 White Horse Laboratories Singapore #05-00 Jay Gee Melwani House 10, Genting Lane Singapore, 349583 65.9870.7758 Services Offered: Substandard and counterfeit detection, failure analysis, lifecycle and reliability testing, and electrical testing. Tools and Techniques: Documentation and packaging inspection, external visual inspection, x-ray fluorescence (XRF), x-ray analysis, heated solvent test, decapsulation and die analysis, SEM, energy dispersive x-ray spectrometry (EDX), scanning acoustic microscopy (SAM), cross-section (microsection), parallel lap, hot spot test, electrical test, thermal cycle, thermal shock, burn-in, drop test, vibration test, environmental exposure (temperature and humidity), salt spray test, electrical overstress testing, mechanical stress testing, curve trace, pin verification test, functional test (primary), DC characteristics, AC characteristics, and temperature range testing. WINTECH NANOTECHNOLOGY Suzhou Nano City NW-09-507 No. 99 Jinji Lake Avenue Suzhou Industrial Park +86.512.62800006 sales-cn@wintech-nano.com www.wintech-nano.com Services Offered: Material analysis, failure analysis, device part analysis, and reliability testing. Tools and Techniques: Decap, delayer, 2D and 3D CT x-ray, SAT/C-SAM, TDR, thermal, FIB, PFIB, EMMI, OBIRCH, nano probe, EBIC/EBAC, AFM, FIB CKT, TOF-SIMS, D-SIMS, AES, XPS, FTIR, AFM, ESD, WireBond, SRP, TC, TS, HTOL, HAST, DPA, re-balling, STEM, TEM, TEM-EDX, SEM BSE, auger, laser microscopy, optical microscopy, SEM-EDX, and 3D nano-CT high-resolution tomography.
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