edfas.org 43 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 2 Thomas Kauerauf, GlobalFoundries; Terry Munson, Foresite Inc.; and Chris Ortiz, ANSYS; as panelists. Among the mentioned challenges were the complexity of modeling reliability at different scales from sub nanometer to multiple millimeters, and the introduction of new technologies including embedded non-volatile memory, advanced packaging, GaN for high voltage and RF applications, and silicon photonics. The strong incentive to use commercial off the shelf (COTS) circuits for space applications was also mentioned as a key reliability challenge. The FA panel was moderated by Jeff Shainline, NIST. The EDFAS FA Technology Roadmap committee was well represented by Lesly Endrinal, Google; Venkat Ravikumar, AMD; and Keith Serrels, NXP. Sarah Wozny from Applied Materials completed the panel. The panelists focused on fault localization challenges, especially for 3D heterogenous integration (3DHI) and the novel use of backside power delivery in advanced technology nodes. They noted that laser-based techniques for stimulation or probing relies on direct line of sight access to the area of interest, which can be challenging especially for visible light probing requiring extreme silicon thinning. There were also several questions on the use of x-ray based tools for both imaging and x-ray assisted device alteration. The panelists commented about the opportunity to leverage the CHIPS Metrology R&D program to foster a deeper collaboration between FA, design-for-test, and design-for-manufacturability. In my view, the workshop’s main highlight was the one-hour project showcase poster session that introduced all 29 currently funded CHIPS Metrology R&D projects. Most of those projects are focused on materials science related to semiconductor devices and metrology needs. Interestingly, some of them directly tackle FA challenges such as atom probe tomography and time-resolved emission microscopy. It became clear to me that NIST scientists showed a strong interest in learning more about FA challenges. This presents a unique opportunity for the FA community to collaborate with NIST in defining projects for a second round of funding to tackle FA gaps identified in the EDFAS FA Technology Roadmap. The conversation will likely continue next October in San Diego during the ISTFA 2024 conference, which we hope will be well attended by NIST. Additional information on NIST CHIPS for America R&D Programs can be found at www.nist.gov/chips/ research-development-programs and on the EDFAS Technology Roadmap at asminternational.org/edfas/ fa-technology-roadmap-committee. GUEST EDITORIAL CONTINUED FROM PAGE 2 MICROSCOPY & MICROANALYSIS MEETING 2024 The Microscopy & Microanalysis (M&M) 2024 meeting will be held July 28 – August 1 in Cleveland. The scientific program features the latest advances in biological, physical, and analytical sciences as well as techniques and instrumentation. Complementing the program is one of the largest exhibitions of microscopy and microanalysis instrumentation and resources in the world. Educational opportunities include a variety of Sunday short courses, tutorials, workshops, and pre-meeting congresses for early-career scientists. The opening reception offers a networking venue for meeting new people in the field and renewing old acquaintances, while the Monday morning plenary session showcases talks from outstanding researchers and recognizes major Society and meeting award winners. In addition, daily poster awards will highlight the best student posters in instrumentation and techniques as well as biological and physical applications of microscopy and microanalysis. M&M is sponsored by the Microscopy Society of America, the Microanalysis Society, and the Microscopical Society of Canada. For more information, visit mmconference.microscopy.org. NOTEWORTHY NEWS
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