edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 2 38 could be applied to the next generation dLVP hardware, where data from a target and its surrounding pixels are collected simultaneously by dithering the laser probe. In practice we could perform multi-channel laser spot dithering on LVP targets, followed by parsing the data with advanced waveform deconvolution techniques. Other exciting concepts include experimental ideas related to the recently published pump probe setups[10] that open up new avenues for dLVP based research. REFERENCES 1. K.A. Serrels and U. Ganesh: “Laser Voltage Probing of Integrated Circuits: Implementation and Impact,” Microelectronics Failure Analysis Desk Reference, 2019, ASM International. 2. Kristofor Dickson, et al.: “Differential Laser Voltage Probe: A New Approach to a Fundamental Technique,” Proc. Int. Symp. Test. Fail. Anal., 2022, p. 144-152, doi.org/10.31399/asm.cp.istfa2022p0144. 3. V.K. Ravikumar, et al.: “Pattern Search Automation for Combinational Logic Analysis,” Proc. Int. Symp. Test. Fail. Anal., 2018, p. 86-92, doi.org/10.31399/asm.cp.istfa2018p0086. 4. V.K. Ravikumar, et al.: “Combinational Logic Analysis Using Laser Voltage Probing,” Proc. Int. Symp. Test. Fail. Anal., 2015, p. 35-41, doi.org/10.31399/asm.cp.istfa2015p0035. 5. G. Ranganathan, et al.: “Enhanced CAD Alignment Technique for FinFET Devices,” Proc. Int. Symp. Test. Fail. Anal., 2022, p. 110-114, doi.org/10.31399/asm.cp.istfa2022p0110. 6. D. Bodoh and K. Erington: “LADA and SDL—Powerful Techniques for Marginal Failures (2022 Update),” Proc. Int. Symp. Test. Fail. Anal., 2022, p. c1-c104, doi.org/10.31399/asm.cp.istfa2022tpc1. 7. Spectrum White Paper, spectrum-instrumentation.com/dl/wp_44xx_ boxcar_average.pdf. 8. C. Nemirow and N. Leslie: “Laser Voltage Tracing—A Novel Approach for Imaging Pulsed Signals,” Proc. Int. Symp. Test. Fail. Anal., 2016, p. 32-37, doi.org/10.31399/asm.cp.istfa2016p0032. 9. A. Koekemoer and K. Linday: “An Investigation of Optimal Dither Strategies for JWST,” JWST REPT, 2005, jwst-docs.stsci.edu/ jwst-general-support/jwst-dithering-overview. 10. M.P. King, et al.: “In-Situ Observation of Circuit Behavior using Pump-Probe Laser Voltage Probe Technique,” IEEE Transactions on Nuclear Science, 2023. ABOUT THE AUTHOR Kristofor Dickson leads the technical staff at NXP Semiconductor in Austin, Texas. He holds a master’s in computer science and B.Sc. in laser physics and optical electronics from the University of Strathclyde in Glasgow, Scotland. His passion is helping to prepare NXP for the next generation failure analysis challenges. IPFA 2024 The 31st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) will be held July 15-18 at the Marina Bay Sands Expo and Convention Centre in Singapore. The event will be devoted to the fundamental understanding of the physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved know-how of the physics of device, circuit, and module failure that serves as critical input for future design and reliability. For the first time, IPFA will be co-located with the International ESD Workshop (IEW Asia 2024). The symposium is technically cosponsored by the IEEE Electron Device Society and IEEE Reliability Society. For more information, visit the IPFA website at ipfa-ieee.org/2024. NOTEWORTHY NEWS
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