May 2024_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 2 30 expansion between the different crystal orientations can generate a slip deformation mechanism at the grain boundaries.[8] The mechanical responses of these devices are affected by the electric current in several aspects. One of the notable effects is the Joule heat generation as a result of the electric current flow. CONCLUSION Despite the tremendous advances in theoretical and numerical studies of thermo-mechanical challenges in cracked media, the influence of electric current flow and electrically induced Joule heat on thermal stress for weld joint cracks at both interfaces is still not fully comprehended. This paper fills this gap and investigates the effect of subjecting the BGA package to a cyclic current input. Current density, Joule effect, and temperature curves are examined. Apart from these outputs, electro-thermal phenomena such as the Peltier effect and the Seebeck effect have been researched and analyzed. All these parameters, added to the thermal cycling temperature, allowed us to obtain stresses and strains, which led us to the conclusion that realistic service conditions are harsher than the conditions studied in previous studies and thus electronic device tends to fail prematurely. REFERENCES 1. J.P.M. Clech, R.J. Coyle, and B. Arfaei: “Pb-Free Solder Joint ThermoMechanical Modeling: State of the Art and Challenges,” JOM, 2019, 71(1), p. 143–157, doi.org/10.1007/s11837-018-3003-0. 2. K.G. Kannan and R. Kamatchi: “Augmented Heat Transfer by Hybrid Thermosyphon Assisted Thermal Energy Storage System for Electronic Cooling,” Journal of Energy Storage, 2020, 27, doi.org/ 10.1016/j.est.2019.101146. 3. B. Debich, et al.: “Design Optimization of PCM-based Finned Heat Sinks for Mechatronic Components: A Numerical Investigation and Parametric Study,” Journal of Energy Storage, 2020, 32, doi.org/ 10.1016/j.est.2020.101960. 4. Y.A. Elkady: “Thermal Performance of Ball Grid Arrays and Thin Interface Materials,” Auburn University, 2005. 5. J.A. Depiver, S. Mallik, and Y. Lu: “Thermo-mechanical Reliability Studies of Lead-free Solder Interconnects,” University of Derby, 2020. 6. K.C. Otiaba, et al.: “Finite Element Analysis of the Effect of Silver Content for Sn-Ag-Cu Alloy Compositions on Thermal Cycling Reliability of Solder Die Attach,” Engineering Failure Analysis, 2013, 28, p. 192–207, doi.org/10.1016/j.engfailanal.2012.10.008. 7. Q. Shao and Y. Liu: “Joule Heating Effect on Thermal Stress for a Bi-material Interface Crack,” International Journal of Solids and Structures, 2021, 226–227, p. 111069, doi.org/10.1016/j.ijsolstr. 2021.111069. 8. C.P. Feng, et al.: “Multifunctional Thermal Management Materials with Excellent Heat Dissipation and Generation Capability for Future Electronics,” ACS Applied Materials and Interfaces, 2019, 11(20), p. 18739–18745, doi.org/10.1021/acsami.9b03885. 9. ANSYS Mechanical APDL Coupled-Field Analysis Guide.pdf. 10. A. Makhloufi, et al.: “Study on the Thermomechanical Fatigue of Electronic Power Modules for Traction Applications in Electric and Hybrid Vehicles (IGBT),” Reliability of High-Power Mechatronic Systems 1, Elsevier, 2017, doi.org/10.1016/B978-1-78548-260-1.50010-8. 11. S. Ghenam, et al.: “Electro-Thermomechanical Modelling of a BGA Assembly Subjected to a Damaging Displacement and to Random Vibrations,” 2022, p. 353–364, doi.org/10.1007/978-3-030-84958-0_38. ABOUT THE AUTHORS Abdelkhalak El Hami is a full professor of the universities exceptional class 2, at INSA Rouen. He has a doctorate of science for engineering from the University of Franche Comté in France and obtained his Habilitation à Diriger des Recherches (HDR) diploma in 2000. He has been a professor at INSA Rouen since September 2000. El Hami is currently Deputy Director of the Normandy Mechanical Laboratory and Head of the chair of mechanics at the Conservatoire Nationale des Arts et Métiers in Normandy. Norelislam El Hami is a professor of computer science at the national school of applied sciences in Kenitra, Ibn Tofail University, Morocco. He obtained a diploma of state engineer in 2000 from the polytechnic faculty of MONS (FPMS) in Belgium. In 2012, he earned a Ph.D. in computer science from the National Institute of Applied Sciences of Rouen (INSA) in France, and a Ph.D. in applied mathematics and computer science from Mohammed V-Agdal University, EMI, Rabat-Morocco. Aicha Koulou has a doctorate in computer science. She is a teacher-researcher at Ibn Tofail University in Kenitra and a research member of the LIRAMEF laboratory (Innovation and Research Laboratory for the Improvement of Teaching and Training Professions). In 2019, she completed a doctoral thesis contributing to improving the interoperability of complex systems. Her research focuses on the interoperability of complex systems, such as information systems and systems of systems, as well as optimization. Maria Zemzami is a professor at Université Mohammed V, Rabat, specializing in software engineering, cloud computing, and network security. Her focus is on information system interoperability and optimization algorithms. She has many scholarly publications, leadership in scientific conferences, and contributions to intellectual property and scientific community development.

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