edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 2 2 I had the fortunate opportunity to attend the first CHIPS Metrology Workshop on Failure Analysis (FA) and Reliability Testing, which was held February 22, 2024, at the NIST Campus in Boulder, Colorado. It was attended by approximately 100 individuals from a wide variety of sectors: government, including NIST and CHIPS act representatives, aerospace and defense, software and hardware tool vendors, service providers, and semiconductor fabless and foundry companies. The workshop was opened by Paul D. Hale, Deputy Director, CHIPS Metrology program. He indicated the workshop was planned thanks to the CHIPS Metrology Industrial Advisory Committee (IAC) recommendation to prioritize FA and reliability. This recognition resulted from efforts made by the EDFAS FA Technology Roadmap’s leadership team who had multiple engagements with the IAC in 2023 to emphasize the need for a focus on FA. Hale also acknowledged that FA was identified as a central component linking all CHIPS for America programs. He stated that the workshop goals were twofold: Give NIST researchers an industry perspective, and evaluate the CHIPS Act Metrology R&D program industry relevance to plan for future projects. The keynote was given by Eric Hadland, director of technology policy at Semiconductor Industry Association (SIA). He emphasized the industry’s unprecedented growth forecast and the associated challenges such as the transition from 2D to 3D, the introduction of new materials, and the increased need for local insight at wafer scale such as TEM automation and wider use of AI/ ML models. The workshop consisted of two panel discussions followed by breakout room discussions for reliability and FA, and a one-hour CHIPS Metrology NIST research project showcase. Overall, the panel discussion’s aim was to introduce the high-level challenges of FA and reliability. The follow-up breakout room discussions mostly consisted of elaborating on the concepts introduced by the panelists through specific questions from NIST moderators. Bob Keller, a NIST group leader and CHIPS metrology program manager, moderated the reliability panel with Brendan Foran, The Aerospace Corp.; MAY 2024 | VOLUME 26 | ISSUE 2 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS GUEST EDITORIAL A SHORT SUMMARY OF THE FIRST CHIPS METROLOGY WORKSHOP ON FAILURE ANALYSIS AND RELIABILITY TESTING Felix Beaudoin, GlobalFoundries felix.beaudoin@globalfoundries.com edfas.org Beaudoin (continued on page 43) PURPOSE: To provide a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers. Nicholas Antoniou Editor/PrimeNano nicholas@primenanoinc.com Mary Anne Fleming Director, Journals, Magazines & Digital Media Joanne Miller Senior Editor Victoria Burt Managing Editor Allison Freeman Production Supervisor ASSOCIATE EDITORS Navid Asadi University of Florida Guillaume Bascoul CNES France Felix Beaudoin GlobalFoundries Michael R. Bruce Consultant Jiann Min Chin Advanced Micro Devices Singapore Edward I. Cole, Jr. Sandia National Labs Michael DiBattista Varioscale Inc. Rosine Coq Germanicus Universitié de Caen Normandie Szu Huat Goh Qualcomm Ted Kolasa Northrop Grumman Space Systems Rosalinda M. Ring Thermo Fisher Scientific Tom Schamp Materials Analytical Services LLC David Su Yi-Xiang Investment Co. Martin Versen University of Applied Sciences Rosenheim, Germany FOUNDING EDITORS Edward I. Cole, Jr. Sandia National Labs Lawrence C. Wagner LWSN Consulting Inc. GRAPHIC DESIGN Jan Nejedlik, jan@designbyj.com PRESS RELEASE SUBMISSIONS magazines@asminternational.org Electronic Device Failure Analysis™ (ISSN 1537-0755) is published quarterly by ASM International®, 9639 Kinsman Road, Materials Park, OH 44073; tel: 800.336.5152; website: edfas. org. Copyright © 2024 by ASM International. Receive Electronic Device Failure Analysis as part of your EDFAS membership. Non-member subscription rate is $175 U.S. per year. Authorization to photocopy items for internal or personal use, or the internal or personal use of specific clients, is granted by ASM International for libraries and other users registered with the Copyright Clearance Center (CCC) Transactional Reporting Service, provided that the base fee of $19 per article is paid directly to CCC, 222 Rosewood Drive, Danvers, MA 01923, USA. Electronic Device Failure Analysis is indexed or abstracted by Compendex, EBSCO, Gale, and ProQuest. Failure analysis panelists at the CHIPS Metrology Workshop on FA.
RkJQdWJsaXNoZXIy MTYyMzk3NQ==