edfas.org 19 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 2 NOTEWORTHY NEWS FIB SEM MEETING 2024 The 16th annual FIB SEM Meeting will be held May 22-23 at the Kossiakoff Center at Johns Hopkins Applied Physics Laboratory in Laurel, Md. The 2024 event will be cohosted by the Canadian Centre for Electron Microscopy. FIB SEM will feature presentations, tutorials, and posters by FIB users and vendors, highlighting new applications and the latest technology. The event offers plenty of technical content as well as opportunities for informal discussions with FIB colleagues. New this year will be student awards for best oral and poster presentations. For more information, visit fibsem.net or email keana.scott@nist.gov. ANADEF 2024 The 19th ANADEF Workshop will be held June 3 to 7 at Belambra Business Club, Seignosse-Hossegor (Landes), France. The conference addresses new issues related to the latest technological developments in electronic component failure analysis, presented through tutorials, plenary sessions, micro-workshops, as well as participation by equipment manufacturers and suppliers. ANADEF, a French nonprofit scientific society established in 2001, meets biennially to bring together industry experts and mechanism scientists concerned with the prevention, detection, and failure analysis of electronic components and assemblies. For more information, visit anadef.org.
RkJQdWJsaXNoZXIy MTYyMzk3NQ==