edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 2 18 ACKNOWLEDGMENTS This material is based on work supported by the National Natural Science Foundation of China under Grant Number 51832002. The first author (ZH) also thanks Chi Yung Ng, the general chair of IPFA 2023, for his invitation and support for a keynote on the conference, which lays the basis for the material presented here. Szu Huat Goh is gratefully acknowledged for his insightful discussion that initiated the writing of this article and for comments on the draft from the perspective of industry. REFERENCES 1. Z. Huang: “Structural Hierarchy from Wavelet Zoom and Invariant Construction,” Discover Materials, 2021, 1(6). 2. Z. Huang, X. Luo, D. Jia, et al.: “Microstructural Hierarchy Descriptor (µSHD)–Property Correlations of Silicon Carbide Ceramics,” J. Eur. Ceram. Soc., 2022, 42(3), p. 801–819. 3. K. Zheng, Z. Huang, D. Jia, et al.: “A Uniform Rule Between Hardness and Structure Hierarchy of Ceramics in Both Direct and Inverse Hall–petch Regimes,” J. Am. Ceram. Soc., 2023, 106(10), p. 5620–5627. 4. www.formge.cn. [Accessed 03-02-2024]. 5. www.mgi.gov. [Accessed 03-02-2024]. 6. A. Rammal, K. Ezukwoke, A. Hoayek, et al.: “Root Cause Prediction for Failures in Semiconductor Industry, A Genetic Algorithm–machine Learning Approach,” Sci. Rep., 2023, 13, p. 4934. 7. S. Bi, C. Wang, B. Wu, et al.: “A Comprehensive Survey on Applications of AI Technologies to Failure Analysis of Industrial Systems,” Engineering Failure Analysis, 2023, 148, p. 107172. 8. A. Safont-Andreu, K. Schekotihin, C. Burmer, et al.: “Artificial Intelligence Applications in Semiconductor Failure Analysis,” EDFA, 2023, 25(2), p. 16–28. 9. www.zeiss.com/microscopy/en/products/ai-microscopy-solutions. html. [Accessed 03-02-2024]. 10. M. Botifoll, I. Pinto-Huguet, and J. Arbiol: “Machine Learning in Electron Microscopy for Advanced Nanocharacterization: Current Developments, Available Tools and Future Outlook,” Nanoscale Horiz., 2022, 7, p. 1427–1477. 11. G.B. Olson: “Computational Design of Hierarchically Structured Materials,” Science, 1997, 277(5330), p. 1237–1242. 12. C.S. Smith: “Structural Hierarchy in Science, Art, and History,” Aesthetics in Science, J. Wechsler, Ed., 1978, p. 9–53. 13. S. Mallat: “Understanding Deep Convolutional Networks,” Philosophical Transactions of the Royal Society A Mathematical, Physical and Engineering Sciences, 2016, 374(2065), p. 20150203. 14. D. Hubel and T. Wiesel: Brain and Visual Perception: The Story of a 25-year Collaboration, 2005, Oxford University Press. 15. S. Mallat: “Group Invariant Scattering,” Communications on Pure and Applied Mathematics, 2012, 65(10), p. 1331–1398. 16. W. Vanderlinde: “Scanning Electron Microscopy,” Microelectronics Failure Analysis: Desk Reference, 2019, ASM International. 17. C.D. Hartfield, T.M. Moore, and S. Brand: “Acoustic Microscopy of Semiconductor Packages,” Microelectronics Failure Analysis: Desk Reference, 2019, ASM International. 18. A. Orozco: “Magnetic Field Imaging for Electrical Fault Isolation,” Micro- electronics Failure Analysis: Desk Reference, 2019, ASM International. 19. W. Vanderlinde: “Energy Dispersive X-ray Analysis,” Microelectronics Failure Analysis: Desk Reference, 2019, ASM International. 20. M. DiBattista and T. Lundquist: “Role of Advanced Circuit Edit for First Silicon Debug,” Microelectronics Failure Analysis: Desk Reference, 2019, ASM International. ABOUT THE AUTHOR Zhiheng Huang is an associate professor at the School of Materials Science and Engineering of Sun Yat-sen University. He received his B.Eng. and M.Eng. degrees in Materials from Harbin Institute of Technology in 2000 and 2002, respectively, and his Ph.D. in manufacturing engineering from Loughborough University in 2005. He is the author of more than 45 journal articles and has written five book chapters. His current research interests include materials and reliability modeling in 3D microelectronic packaging, materials genome engineering, and integrated computational materials engineering. He is a member of IEEE. Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis: Mark Levis, Business Development Manager 440.671.3834, mark.levis@asminternational.org Current rate card may be viewed online at asminternational.org/advertise.
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