edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 1 50 James Demarest, FASM, Awards & Nominating Com- mittee chair, announced that the 2023 President’s Award was given to David Burgess for providing mentoring, formal teaching, and specialty tools worldwide for mem- bers of the EDFAS community. The 2023 Lifetime Achievement Award was presented to David Albert for dedication and leadership in the sustained development of the nanoprobing fault isolation technique over 42 years and for being a patient teacher and loyal custodian in EDFAS. Demarest noted that two EDFAS members became ASM Fellows: Christian Boit, FASM and Jeremy Walraven, FASM. The Board of Directors strives to strengthen the visibility and credibility of our Society by providing value to EDFAS members, and through its volunteers, beneficial contributions to our industry. The EDFAS Board of Directors thanks all the volunteers who make our society the success that it is today. As with any society, we are constantly looking for more volunteers to help shape the future; therefore, if you or someone you know is interested in helping, please contact an EDFAS board member today! GUEST EDITORIAL CONTINUED FROM PAGE 2 Defense industry and government leader presentations also included Timothy Lee, Technical Fellow, Boeing, who gave a talk titled 3DHI for Aerospace and Defense Applications: State-of-the-Art Edge Computing and High-Bandwidth Communications. Patty Chang-Chien, Vice President and General Manager, Boeing Research and Technology, spoke on 3D Microelectronics Research and Packaging. Laurie Locascio, Under Secretary of Commerce for Standards and Technology and Director, National Institute of Standards and Technology (NIST), and Margaret Martonosi, Assistant Director for Computer and Information Science and Engineering, U.S. National Science Foundation, talked about the CHIPS act. And Justin Ford, Sandia National Laboratories, spoke on Chal- lenges and Solutions to Failure Analysis in 3D Microsystems. The plenary talks from the summit can also be viewed on the DARPAtv - YouTube Channel at youtube.com/user/ DARPAtv/videos. A key element of the ERI 2.0 Summit also featured overviews from Carl McCant, Special Assistant to the DARPA director for ERI, on the progress of “Phase 0” of the Next Generation Microelectronics Manufacturing (NGMM) program, as well as updates from the eleven different performer teams. The eleven teams selected for the Phase 0 analysis project included seven large businesses, two educational institutions, one small business, and one non-profit. Specifically, the teams were Applied Materials (RF phased array, system on chip), Arizona State University (RF massive MIMO microsystems), HRL Laboratories (mmW phased array, focal plane array), ICAMR Inc. (V-band phased array), Intel Federal LLC (slice of vertically stacked cube), North Carolina State University (power microsystem), Northrop Grumman Mission Systems (infrared focal plane array), Northrop Grumman Space Systems (mmW MFA), PseudolithIC Inc. (mmW phased array), Raytheon Technologies (mmW phased array), and Teledyne Scientific Co. (point-of-load voltage converter). The NGMM program creates a focused government effort to establish 3DHI pilot-line manufacturing centers, which McCants is quoted as depicting “a stable, precommercial process, but one we’ll be able to utilize as a catalyst for research and development of 3DHI manufacturing capabilities.” Advancing from Phase 0, the NGMM Program Phase I has projected funding worth $420 million for installing equipment, establishing baseline fabrication processes, developing the 3D assembly design kits, and designing 3DHI automation and simulation software. The adoption of 3DHI represents a new challenge for failure analysis due to the wide adoption of chiplets that include new technologies, die stacking, materials, and photonics beyond monolithic advanced manufacturing node silicon. How the failure analysis community responds is one of the many challenges in our future. Dr. Carl McCants presenting at the 2023 ERI 2.0 Summit Creating the 3D Microsystems of Tomorrow.
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