edfas.org 49 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 1 BOARD OF DIRECTORS NEWS EDFAS BOARD OF DIRECTORS REPORT Chris Richardson, EDFAS Secretary, Allied High Tech Products Inc. crichardson@alliedhightech.com The EDFAS Board of Directors held its annual faceto-face meeting on Saturday November 11, 2023, in Phoenix, prior to ISTFA 2023. EDFAS board president Felix Beaudoin, FASM, reflected on a very successful year that saw the implementation of many long-term vision projects; the Failure Analysis Technology Roadmap was released, quarterly Webinar Series, and the acceptance of ISTFA papers into the selection process for a special issue of the Journal of Failure Analysis and Prevention, a technical journal with an impact factor to help draw more technical contributions from universities. These projects help reinforce our society vision of Enlarge, Engage, and Empower. The FA Roadmap framework comprises three Councils: Die-level Roadmap Council (DLRC), Package Innovation Roadmap Council (PIRC), and FA Future Roadmap Council (FAFRC). To incorporate a common FA workflow, the DLRC hosts two separate domain teams: an Isolation Domain and Post-isolation Domain. While the DLRC and PIRC define the current technical challenges facing our community, the FAFRC is tasked with looking ahead to determine what may be coming next by surveying reputable industry roadmaps and reporting on related near-term developments/challenges that have a tangible five- to ten-year horizon. The FA Roadmap is now available in the ASM Digital Library. A quarterly webinar series was successfully launched this year with the goal to introduce individuals to EDFAS, showcase opportunities in EDFA, and expand EDFAS engagement beyond ISTFA. The talks are viewable online with ASM Connect. In March Nicholas Antoniou spoke on scanning microwave impedance microscopy, in June Yan Li described, “Learning More About 3D Packaging Architecture,” in September Navid Asadi talked about physical inspection and assurance of electronics, and in December Brenda Prenizer presented a talk called “Mr. Toad’s Wild Ride.” ASM Director for Membership and Affiliates, Nicole Hale, discussed overall membership, which recovered to a pre-COVID growth trajectory. Finances for the organization are still expected to meet targets, with more of the numbers back to pre-COVID values. The General Chair for ISTFA 2023, Frank Altmann provided a final update for the conference that featured a new technical session on power devices (Si, SiC, GaN), 29 tutorials, 95 technical papers/presentations and six user groups. The keynote speech by Peter Friedrichs, talked about silicon carbide (SiC) devices, which are critical in powerconversion circuits that include solar and electrical vehicles. An engaging panel discussion, “Charging Forward: Navigating Reliability and Failures in Power Electronics,” with industry and academic members rounded off a very exciting and technically packed conference. ISTFA 2024 marks the 50th anniversary of the conference and will be held in San Diego, California, October 28 through November 1. General Chair Yan Li announced the conference theme, “Riding the Wave of Artificial Intelligence.” Kristofor Dickson was unanimously approved by the Board to serve as the Technical Program Chair. “THE EDFAS BOARD OF DIRECTORS THANKS ALL THE VOLUNTEERS WHO MAKE OUR SOCIETY THE SUCCESS THAT IT IS TODAY. ”
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