edfas.org 35 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 1 ISTFA SPONSORS & SUPPORTERS On behalf of the Electronic Device Failure Analysis Society (EDFAS) and the organizers of ISTFA 2023, we appreciate your generous sponsorship contribution and recognize your continued commitment in making the ISTFA Conference and Exposition an outstanding event! Sponsors Allied High Tech Products, Inc. BSET EQ Siemens Thermo Fisher Scientific ULTRA TEC ZEISS Congratulations to the following winners: ISTFA 2023 BEST PAPER: “Assessing Electronics with Advanced 3D X-ray Microscopy Techniques and Electron Microscopy” Herminso Villarraga-Gómez, Zeiss ISTFA 2023 OUTSTANDING PAPER: “Finite Element Analysis (FEA) and Fractography: Complementary Methods in Understanding the Factors Resulting to Hairline Die Crack on Chip-On-Lead (COL) Device” Renald Lindayao Dechino, Melanie S. Cajita, Nico Deus Villafranca, and Marionne Jose F. Javien, Analog Devices Inc. ISTFA 2023 ATTENDEES’ BEST PAPER: “Advances in High-Resolution Non-Destructive Defect Localization based on Machine Learning Enhanced Signal Processing” Sebastian Brand, Michael Koegel, Christian Grosse, Frank Altmann, and Christian Hollerith, Fraunhofer IMWS, and Pascal Gounet, STMicroelectronics ISTFA 2023 BEST POSTER: “Magneto-Optic Kerr Imaging Technique for Localizing Magnetic Failures” Ricky Anthony and Jer O’Sullivan, Analog Devices Inc. ISTFA 2023 OUTSTANDING POSTER: “Electron Beam Induced Resistance change for Isolation of Wordline Shorts in 3D Replacement Gate NAND” Chandler Rich, Micron Technology Inc. EDFAS 2023 PHOTO CONTEST WINNERS Congratulations to the following winners: Category I: Color Images 1st Kristof J.P. Jacobs, IMEC 2nd Stephen Fasolino, Raytheon McKinney 3rd Kevin Awai, Raytheon Intelligence & Space Category II: Black & White Images 1st Susanne Hübner, Fraunhofer Institute for Microstructure of Materials and Systems IMWS 2nd Serge Kozhokar, Hi-Rel Laboratories Inc. 3rd Paul John B. Sotto, Analog Devices General Trias Inc. Category III: False Color Images 1st Heiko Stegmann, Carl Zeiss Microscopy GmbH 2nd Paul Cudmore, Hi-Rel Laboratories Inc. 3rd Flavio Cognigni, Sapienza University of Rome The first-place winner in each category receives a wall plaque and complimentary registration to ISTFA 2024. Second and third places in each category receive award certificates and a $25 gift certificate. Winning entries will be featured on the cover of this magazine during 2024. EDFAS 2023 VIDEO CONTEST WINNER Congratulations to the following winner: “Phase Segmentation in a Superjunction MOSFET using FIB-SEM tomography and 3D EDX” Flavio Cognigni, Sapienza University of Rome, Heiko Stegmann, Carl Zeiss Microscopy GmbH, and Domenico Mello, STMicroelectronics The winner received a $150 gift card and first-place winner plaque. Corporate Supporters Comet Yxlon Quartz JIACO Instruments SELA Mesoscope Synopsys Nanoscience Instruments Ted Pella Inc. Nordson Test & Inspection Media Sponsor EDFA Magazine
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