edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 1 34 roadmap councils, namely Die-level Isolation and Post- isolation, Package Innovation, and FA Future, delivered comprehensive reports summarizing their gap analyses and highlighting the existing technical challenges in the semiconductor failure analysis community. Special thanks to Vinod Narang from AMD and Keith Serrels from NXP for their diligent efforts. The FA Roadmap session was meticulously prepared, presenting materials in a comprehensive and thorough manner. The event generated considerable interest from tool vendors. ISTFA EXPO Advanced tools are essential for the pursuit of ever smaller and more elusive defects in the field of failure analysis. That’s why the Expo at the ISTFA conference is always a highly anticipated event. This year, a total of 77 companies showcased their latest tools, techniques, and solutions in the FA field, encompassing areas such as test, diagnosis, fault isolation, sample preparation, imaging, and characterization. With 98 booths, the Expo provided a platform for tool and technique suppliers to connect with users, benefitting both parties. Vendors received valuable feedback from users to further improve their offerings, while users had the opportunity to explore the latest developments by visiting various vendors in one place. Special thanks go to Becki Watt from Mentor and Rosalinda Ring from Thermo Fisher Scientific for their dedicated efforts in organizing the Expo. ISTFA goes beyond being a technical conference; it serves as a gathering for a vibrant community. The success of ISTFA is indebted to the tireless efforts of numerous volunteers and the exceptional support provided by ASM International. I extend my heartfelt gratitude to all the volunteers, session chairs/co-chairs, reviewers, and, notably, the ISTFA 2023 Organization Committee and ASM International staff for their invaluable contributions. JOIN US AT ISTFA 2024 While ISTFA 2023 has concluded, the essence of the event continues to thrive. Looking ahead, ISTFA 2024 is scheduled to take place from October 28 – November 1 in San Diego. The organizing committee, led by the esteemed General Chair Yan Li, has already commenced preparations for the upcoming conference. We encourage you to consider volunteering and showcasing your innovative work at ISTFA 2024. Join us in shaping another remarkable event! ISTFA 2023 ORGANIZING COMMITTEE: General Chair - Frank Altmann, Fraunhofer IMWS Vice General Chair - Yan Li, Samsung Technical Program Chair - Renee Parente, AMD Tutorial & Short Course Chairs Bernice Zee, AMD and Ted Kolasa, Northrop Grumman Panel Discussion Chairs - Erwin Hendarto, Silicon Labs and Chuan Zhang, NVIDIA Corp., University of California User Group Chairs - Daminda Dahanayaka, IBM and Joy Liao, NVIDIA Corp. and Anita Madan, Independent Consultant Roadmap Chairs - Vinod Narang, AMD and Keith Serrels, NXP Exposition Chairs - Becki Watt, Mentor and Rosalinda Ring, Thermo Fisher Scientific Movie Chair - Rosalinda Ring, Thermo Fisher Scientific AV Chairs - Kristofor Dickson, NXP and Eckhard Langer, GlobalFoundries International Chairs - Guillaume Bascoul, CNES – French Space Agency and Bernice Zee, AMD University Chairs - Navid Asadi, University of Florida and Vincent Immler, Oregon State University Local Arrangements Chair - Ted Kolasa, Northrop Grumman Past Conference Chair - Zhigang Song, IBM
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