edfas.org 33 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 1 The Women in Electronics Failure Analysis (WEFA) lunch has become an annual favorite networking event at ISTFA. TECHNICAL PROGRAM Thanks to the hard work by Technical Program Chair Renee Parente from AMD together with a team of 40 session chairs and 157 reviewers, the ISTFA 2023 Symposium featured 72 high-quality oral and 24 poster presentations and invited talks. ISTFA Best and Outstanding Papers were selected based on attendees’ votes for the papers nominated by the session review committees. Congratulations to the award winners! “Wide band gap power devices and related robustness and reliability aspects” were the focus of the keynote given by Dr. Peter Friedrichs, vice president, SiC Infineon. SiC devices are advantageous in power-conversion circuits for efficient applications like solar inverters and electric vehicles. However, deploying SiC technology is still in the early stages compared to silicon. In his keynote, he shared his experiences into effectively deploying SiC devices and addressing their unique failure modes. This provided valuable insights into the long-term reliability and failure modes of SiC power devices, tailored to specific applications. Erwin Hendarto from Silicon Labs and Chuan Zhang from Nvidia Corp. and the University of California, along with last-minute support from Renee Parente from AMD, chaired an exciting and thought-provoking panel discussion titled “Charging Forward: Navigating Reliability and Failures in Power Electronics.” The panel included four esteemed field experts from academia and industry who shared their valuable insights on the reliability, physics, and failure analysis of SiC and Group-III-nitride power electronics. Another key element of ISTFA are the user groups which provide an interactive platform to discuss best practices, current problems, and future trends in failure analysis, closely aligned to the EDFAS roadmap. For 2023, a new user group was added which delved into the topic of standardized and AI-enhanced FA workflows; bringing the total number of user groups up to six. Thanks to Daminda Dahanayaka, IBM, Joy Liao, Nvidia Corp., and Anita Madan, independent consultant, for their efforts, the user group sessions were well-received. Thanks to university chairs Navid Asadi and Vincent Immler, for the first time, authors will have the chance to publish their work in a special issue of ASM's Journal of Failure Analysis and Prevention. The FA Roadmap session garnered significant atten- dance for the second consecutive year. The three FA Visitors to the Membership Lounge described what keeps them coming back to ISTFA.
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