edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 1 32 EDFAAO (2024) 1:32-34 1537-0755/$19.00 ©ASM International® ISTFA 2023 HIGHLIGHTS Frank Altmann, ISTFA 2023 Conference Chair Fraunhofer IMWS frank.altmann@imws.fraunhofer.de Peter Friedrichs from Infineon delivered the keynote to a packed audience. The 49th International Symposium for Testing and Failure Analysis (ISTFA), which was held successfully in Phoenix from November 12 to 16, focused on the theme of “Moving Toward Reliable Power Electronic Devices.” The symposium addressed the pressing need to increase energy efficiency and save global resources by developing efficient and reliable power electronics devices. Power semiconductors based on silicon carbide (SiC) and gallium nitride (GaN) technologies were highlighted for their potential to enable smaller sizes, lighter weight, lower costs, and higher efficiency in power electronics systems. However, challenges related to robustness and reliability still exist, posing obstacles on the path to mass market adoption. The symposium emphasized the importance of understanding defect formation, degradation mechanisms, and employing adaptive failure analysis methodologies to overcome these challenges. A grand total of 775 attendees actively participated in a wide array of events, encompassing the technical program, tutorials, keynote speeches, panel discussions, user group discussions, and the exhibition. Alongside these innovative and informative technique-oriented events, attendees also relished the opportunity to unwind and engage in relaxed social events, networking sessions, and coffee breaks. These moments fostered meaningful conversations, allowing participants to connect with one another and build valuable connections. ISTFA 2023 kicked off on Saturday, November 11 with education workshops, followed on Sunday by 29 tutorials on topics such as fault isolation, microscopy, package and physical analysis challenges, as well as technologyspecific failure analysis. A special thanks goes to all committee members for their strong support to setup of the technical program of the conference.
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