edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 1 2 The Defense Advanced Research Project Agency (DARPA) launched the second Electronics Resurgence Initiative (ERI 2.0) Summit on August 22-24, 2023, in Seattle as a response to the United States government’s nationwide microelectronic manufacturing concerns. This is one of many U.S. government initiatives to stimulate domestic semiconductor manufacturing including: SHIP – State of the art Heterogeneous Integrated Packaging RESHAPE – Re-Shore Ecosystem for Secure Heterogeneous Advanced Packaging Electronics RAMP-C – Rapid Assured Microelectronics Prototypes NSTC – National Semiconductor Technology Center NAPMP – National Advanced Packaging Manufacturing Program ME Commons – Microelectronics Commons NGMM – Next Generation Microelectronics Manufacturing ERI – Electronics Resurgence Initiative The ERI 2.0 DARPA-based initiative from the Microsystems Technology Office (MTO) is focused on driving next generation dual use microelectronics for national security and domestic needs by creating U.S. capability for threedimensional heterogeneous integration (3DHI) manufacturing and pursuing focused research for the manufacture of complex 3D microsystems. This effort represents an inflection point and brings forward significant challenges and opportunities for the failure analysis community to contribute successfully to 3DHI manufacturing. Semiconductor, defense industry, academia, and government leaders from across the U.S. presented their vision and insight for next generation 3DHI semiconductors manufacturing during the three-day conference with the keynote addresses by Patrick Gelsinger, CEO, Intel Corp. and Stefanie Tompkins, DARPA Director. Semiconductor industry leaders and expert talks throughout the conference included Pooya Tadayon, Fellow and Director of Assembly and Test Pathfinding, Intel Corp., who spoke on Challenges & Opportunities in 3D IC Test, Ahmad Bahai, Senior Vice President and Chief Technology Officer, Texas Instruments, talked about the Impact of 3D Heterogeneously Integrated Microsystems on Analog, Mixed-Signal, and RF Applications and Capabilities. Joshua Fryman, Fellow, Intel Corp. talked about New Applications Enabled by Complex 3D Microsystems, and Bill Dally, Chief Scientist and Senior Vice President of Research, Nvidia Corp. also presented. The slides and presentations for all the plenary talks are available online at https://eri-summit.darpa.mil/2023-agenda. FEBRUARY 2024 | VOLUME 26 | ISSUE 1 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS GUEST EDITORIAL THE ELECTRONICS RESURGENCE INITIATIVE 2.0 FOR U.S. SEMICONDUCTOR MANUFACTURING Michael DiBattista, Varioscale miked@varioscale.com edfas.org DiBattista (continued on page 50) PURPOSE: To provide a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers. Nicholas Antoniou Editor/PrimeNano nicholas@primenanoinc.com Mary Anne Fleming Director, Journals, Magazines & Digital Media Joanne Miller Senior Editor Victoria Burt Managing Editor Allison Freeman Production Supervisor ASSOCIATE EDITORS Navid Asadi University of Florida Guillaume Bascoul CNES France Felix Beaudoin GlobalFoundries Michael R. Bruce Consultant Jiann Min Chin Advanced Micro Devices Singapore Edward I. Cole, Jr. Sandia National Labs Michael DiBattista Varioscale Inc. Rosine Coq Germanicus Universitié de Caen Normandie Szu Huat Goh Qualcomm Ted Kolasa Northrop Grumman Space Systems Rosalinda M. Ring Thermo Fisher Scientific Tom Schamp Materials Analytical Services LLC David Su Yi-Xiang Investment Co. Martin Versen University of Applied Sciences Rosenheim, Germany FOUNDING EDITORS Edward I. Cole, Jr. Sandia National Labs Lawrence C. Wagner LWSN Consulting Inc. GRAPHIC DESIGN Jan Nejedlik, jan@designbyj.com PRESS RELEASE SUBMISSIONS magazines@asminternational.org Electronic Device Failure Analysis™ (ISSN 1537-0755) is published quarterly by ASM International®, 9639 Kinsman Road, Materials Park, OH 44073; tel: 800.336.5152; website: edfas. org. Copyright © 2024 by ASM International. Receive Electronic Device Failure Analysis as part of your EDFAS membership. Non-member subscription rate is $175 U.S. per year. Authorization to photocopy items for internal or personal use, or the internal or personal use of specific clients, is granted by ASM International for libraries and other users registered with the Copyright Clearance Center (CCC) Transactional Reporting Service, provided that the base fee of $19 per article is paid directly to CCC, 222 Rosewood Drive, Danvers, MA 01923, USA. Electronic Device Failure Analysis is indexed or abstracted by Compendex, EBSCO, Gale, and ProQuest.
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