edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 26 NO. 1 DEPARTMENTS Advanced Characterization of Materials using Atom Probe Tomography Jacob M. Garcia and Ann N. Chiaramonti New materials integration and improved design can be promoted by using atom probe tomography as an analysis technique, shown through several diverse examples. Author Guidelines Author guidelines and a sample article are available at edfas.org. Potential authors should consult the guidelines for useful information prior to manuscript preparation. 4 14 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS FEBRUARY 2024 | VOLUME 26 | ISSUE 1 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS 2 GUEST EDITORIAL Michael DiBattista 36 CALL FOR PAPERS 37 PANEL & USER GROUP SUMMARY 47 2024 EDFAS AWARDS 48 2023 EDFAS AWARD WINNERS 49 BOARD OF DIRECTORS NEWS Chris Richardson 51 CALL FOR NOMINATIONS James Demarest 52 LITERATURE REVIEW Michael R. Bruce 53 PRODUCT NEWS Ted Kolasa 55 TRAINING CALENDAR Rosalinda Ring 56 ADVERTISERS INDEX Processes for Thinning and Polishing Highly Warped Die to a Nearly Consistent Thickness: Part III Kirk A. Martin The processes and considerations for both global and area of interest are discussed and reference process recipes are given in Part III of this series. 24 For the digital edition, log in to edfas.org, click on the “News/Magazines” tab, and select “EDFA Magazine.” Four-dimensional Scanning Transmission Electron Microscopy: Part II, Crystal Orientation and Phase, Short and Medium Range Order, and Electromagnetic Fields Aaron C. Johnston-Peck and Andrew A. Herzing The second part of this series presents applications of 4D-STEM, including measurements of crystal orientation and phase, short- and medium-range order, and internal electromagnetic fields. 14 4 ISTFA 2023 Highlights A recap of the ISTFA 2023 event includes General Chair Frank Altmann’s wrap-up as well as a list of the winning ISTFA papers and posters. 32 ABOUT THE COVER Sintering-induced crack formation in an inkjet-printed silver nanoparticle metallization line. This was observed during the development of a novel sample preparation method aimed at rerouting probe pads to enhance the imaging resolution of microscopy-based debug techniques. The colorful background stems from a thin film interference effect in the deposited dielectric film. Photo by Kristof J.P. Jacobs, IMEC, First Place Winner in Color Images, 2023 EDFAS Photo Contest. 24 32
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