edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 4 56 them to provide higher output power. These IGBTs are also fully rated as soft fast reverse-recovery diodes. This means they are suitable for rectifier and bi-directional circuit applications or to protect against overcurrent conditions. For more information, visit.nexperia.com. SPECIMEN HOLDER FOR LIQUID SAMPLE ANALYSIS IN TEM The K-kit system is an innovative tool that allows the examination of liquids in a TEM without the use of specialized TEM holders, feedthroughs, or equipment. K-kits are sample holders designed to facilitate TEM observations of liquid samples, allowing nanoparticles, aggregates, and agglomerates to be characterized in a liquid medium. With vacuum compatible sealing of liquids in electrontransmitting thickness, K-kits are micro reaction chambers for countless experiments in materials, chemical, and biological research. The K-kit facilitates direct observation in final pro- duct form or relevant media while minimizing artifacts, image-based statistical analysis of aggregation and agglomeration as well as particle concentration, and K-kits are available in packages of 4 or 6 (shown). characterization to all physicochemical requirements. Each specimen cell is in its own car- rier, which includes a clear cap, a car- rier with the K-kit sitting on top of the plate and a bottom compartment housing a copper grid. The carrier is designed as a protective container during storage and shipment. It also serves as sample preparation facilitator and thus, the K-kit stays on the carrier plate for the entire sample preparation protocol until after the copper grid is attached. For more information, visit www.2spi.com. ABOUT THE COVER All images are from the 2022 EDFAS Photo Contest. Images and captions have been edited from original submitted entries. Top left: Electron backscatter diffraction cartography of the balls on a BGA component. Photo by Djemel Lellouchi, ELEMCA, Second Place Winner, False Color Images. Top middle: SEM image of the silicon after DRIE etching. This is the scalloping generated by a bad etching. Photo by Djemel Lellouchi, ELEMCA, Third Place Winner, Black and White Images. Top right: Color image of Abraham Lincoln “admiring” the internal circuitry of an ultra-low noise amplifier in an extremely small 2 mm x 2 mm surface-mount package that was manually decapsulated. Photo by Kevin Awai, Raytheon, Second Place Winner, Color Images. Bottom left: SEM image of a creeping stellar dendrite snow crystal using a FEI SCIOS 2 Dual Beam system. Photo by Jonelle Mananguit, Analog Devices, Second Place Winner, Black and White Images. Bottom middle: Breakdown in the piezoelectric capacitor in a MEMS structure observed at optical microscope. Photo by Audrey Garnier, STMicroelectronics, Third Place Winner, Color Images. Bottom right: Quantum diamond microscope magnetic images showing a short-circuit fault within an ion chip trap used for quantum computing (top). Mounting a synthetic diamond sample with a thin sensing layer on top of the bowtieshaped ion trap (bottom), we stitched five magnetic images to reconstruct the internal current path. Photo by Pauli Kehayias, Sandia National Laboratory, Third Place Winner, False Color Images.
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