edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 4 54 PROFILERS MEASURE ELECTRICAL PROPERTIES AT ATOMIC LEVEL The ALPro 50 and ALPro 100 are metrology tools for depth profiling electrical properties of semiconductor layers at ultra-high resolution. ALPro technology uses proprietary processing and the differential Hall effect metrology (DHEM) technique. Key applications include characterization/optimization of ultra-shallow junctions, high mobility materials, epi-layers, and doping/anneal processes. As features sizes get smaller, contact interface resistance has become a key factor in device performance. For high mobility materials, one needs to characterize the films with direct measurement. Characterization of the top layers of the films at ultra-high resolution has become critical for development of advanced devices. The ALPro Profiler is the first instrument capable of rapidly measuring and depth profiling all the critical electrical properties of semiconductor layers at atomic-level resolution. The ALPro is ideal for process development of epitaxy, implant, and anneal layers. It precisely measures doping levels in films used in transistor source-drain regions. The DHEM technique is carried out in three stages: First, the electrically active thickness of the layer to be characterized is reduced by a tightly controlled amount at a selected measurement area on the wafer surface using a proprietary process. Second, precise electrical measurements of the thinned down layer are carried out to obtain the sheet resistance and mo- bility values, and third, the electrical parameter depth PRODUCT NEWS Ted Kolasa, Northrop Grumman ted.kolasa@gmail.com PRESS RELEASE SUBMISSIONS: MAGAZINES@ASMINTERNATIONAL.ORG BACKSIDE ILLUMINATED TDI CAMERA Teledyne Dalsa, a Teledyne Technologies company, announces its Linea HS 16k backside illuminated (BSI) TDI camera, is now in production. With its CLHS interface, this camera offers enhanced sensitivity and is ideal for near ultraviolet and visible imaging applications such as wafer, flat panel display and electronic packaging inspection, as well as photoluminescence and life science imaging. The new Linea HS 16k BSI uses Teledyne Dalsa’s charge-domain CMOS TDI 16k sensor with a 5 x 5 μm pixel size and delivers a maximum line rate of 400 kHz aggregate. Compared with front side illumination (FSI), the BSI model significantly improves quantum efficiency in the near ultraviolet and visible wavelengths and boosts signal-to-noise ratio for imaging applications in light starved conditions. Linea HS is the industry’s leading TDI product family for high-speed and high-sensitivity imaging. It provides cutting edge performance based on multi-array chargedomain CMOS TDI technology, offering advanced capabilities including mono/HDR, color, multifield, and super resolution imaging for demanding machine vision applications. Linea HS 16k BSI also has the same form factor as the Linea HS FSI, so existing systems can be easily upgraded. For more information, visit teledynedalsa.com. The new Linea HS 16k BSI camera is ideal for near ultraviolet and visible imaging applications. The ALPro Profiler uses DHEM technology to profile the electrical properties of semiconductor layers.
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