edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 4 50 TRAINING CALENDAR LIFELONG LEARNING EDFAS believes in lifelong learning and supporting our members and customers in that endeavor. Our goal is to provide a list of educational resources in failure analysis and related topics in each issue of EDFA magazine. In addition, explore all EDFAS has to offer from regional events, chapter courses, and tutorials and courses during ISTFA. Find out more by visiting edfas.org. Rosalinda M. Ring, Thermo Fisher Scientific jmj4papa@yahoo.com EVENT DATE LOCATION IEEE/ACM International Conference on Computer-Aided Design (ICCAD) 2023 10/2911/2 San Francisco, CA Contact: ICCAD AVS 69th International Symposium & Exhibition 11/5-15 Portland, OR Fundamentals of Vacuum Technology 11/6-9 Portland, OR Contact: AVS Principles of Failure Analysis 11/6-9 Novelty, OH 49th International Symposium for Testing and Failure Analysis (ISTFA) 11/12-16 Phoenix, AZ Practical Fractography 11/13-14 Novelty, OH Advanced Metallographic Techniques 11/13-16 Novelty, OH Introduction to Metallography 11/28-29 Novelty, OH Contact: ASM International Advanced Electronics Assembly Conference (AEAC) 11/9 Budapest, Hungary Contact: SMTA Taiwan Association for Coating and Thin Film Technology (TACT), International Thin Films Conference 11/10-15 Taipei, Taiwan Contact: TACT SEMICON Europa 2023 11/14-17 Munich, Germany Advanced Packaging Conference (APC) 11/15 Munich, Germany Fab Management Forum (FMF) 11/15 Munich, Germany Contact: SEMI Europa November 2023 EVENT DATE LOCATION IEEE International Future Energy Electronics Conference (IFEEC) 2023 11/20-23 Sydney, Australia Contact: IFEEC 2023 Materials Research Society (MRS) Fall Meeting and Exhibit 11/2612/1 12/5-7 Boston, MA Virtual Event Contact: MRS November 2023 (cont'd) EVENT DATE LOCATION Scanning Electron Microscopy 12/1 Novelty, OH Principles of Failure Analysis 12/11-13 Virtual Event Contact: ASM International Workshop on Innovative Nanoscale Devices and Systems (WINDS) 2023 12/3-8 Kailua-Kona, HI Contact: WINDS IEEE International Electron Devices Meeting (IEDM) 12/9-13 San Francisco, CA Contact: IEDM SEMICON Japan Advanced Packaging and Chiplet Summit (APCS) FLEX Japan 12/13-15 Tokyo, Japan Contact: SEMICON Japan 54th IEEE Semiconductor Interface Specialists Conference (SISC) 12/13-16 San Diego, CA Contact: SISC December 2023
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