edfas.org 49 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 4 ROODMICROTEC FAILURE AND TECHNOLOGY ANALYSIS Oettinger Str. 6, 86720 Nördlingen Germany +44.7968.948683 malkit.jhitta@roodmicrotec.com www.roodmicrotec.com Services Offered: Electrical and functional failure analysis, physical failure analysis, nondestructive testing, and material analyses. Tools and Techniques: Functional check on devices, printed board assemblies (PBAs), modules and systems, verification of functionality, circuit analysis, failure simulation and reproduction, optoelectronic and vehicle specific measurements, ESD certification, authenticity verification tests, IC modifications with FIB, x-ray and scanning acoustic microscopy, light optical and scanning electron microscopy, chemical and mechanical decapsulation, failure localization with emission microscopy and liquid crystal thermography, reverse processing (wet and dry etching), metallographic cross-sectioning, mounting- and material analysis, solder joint assessment, risk analysis and recommendation of corrective actions, particle impact noise detection (PIND), leak tests, and SEM/EDX. SEMION LLC 1055 NE 25th Ave., Suite H Hillsboro, OR 97124 503.332.9668 info@semionco.com www.semionco.com/applications-and-analytical-services Services Offered: SEM, TEM, and FIB analytical services for full 300 mm semiconductor wafers and pieces, materials samples, and biological specimens. Tools and Techniques: FEI Expida 1265 Dualbeam FIB/ SEM, FEI XL 835 Dualbeam FIB/SEM, Philips CM 120 TEM, Philips CM 200 TEM, high resolution SEM/STEM imaging, FIB cross sectioning and imaging, sample preparation, EDS elemental analysis, probe milling, and device edit and fabrication. SMART MICROSYSTEMS LTD. 141 Innovation Dr. Elyria, OH 44035 440.366.4203 info@smartmicrosystems.com www.smartmicrosystems.us/new-contact-us Services Offered: Test and inspection, failure analysis, reliability and environmental life test, and super UV testing. Tools and Techniques: Precision measurement, acoustic microscopy, SEM, 3D x-ray, pressure controller, interferometry, bond testing, HAST, thermal/humidity cycling and steady-state, and thermal shock. SPIRIT ELECTRONICS DEVICE ANALYSIS 11202 N. 24th Ave. Phoenix, AZ 85029 480.998.1533 info@spiritelectronics.com www.spiritelectronics.com/services Services Offered: Testing and screening, environmental testing, reliability testing, radiation testing, microelectronics inspection services, failure analysis, destructive physical analysis, package integrity testing, RoHS auditing inspection, reverse engineering, and IP analysis/litigation support. Tools and Techniques: X-ray inspection, wafer lot acceptance, C-SAM, PIN-D, XRF analysis, x-ray inspection, and solderability. ZESTRON Europe Bunsenstr. 6 85053 Ingolstadt Germany +49.841.635.26 North America 11285 Assett Loop Manassas, VA 20109 703.393.9880 o.schoenfeld@zestron.com www.zestron.com/en/home Services Offered: Assembly precision cleaning, reliability and surfaces (risk assessments and avoidance), and training academy. Visit the Electronic Device Failure Analysis Society website edfas.org
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