edfas.org 43 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 4 engineers and scientists into the realm of semiconductor analysis; promote innovation and invention in this field; encourage collaboration between engineers from different companies; encourage co-development of novel analytical techniques and equipment between FA engineers, academia, and vendors; and gather information on the needs of FA engineers and guide vendors to focus development efforts that fulfill those needs. Jim Colvin comes from the Midwest and holds an electrical engineering degree from Purdue University. He has 33 years of contributions to the failure analysis community through committee organizations for ISTFA, EOS/ESD, IPFA, and IRPS, and has published more than 20 papers on failure analysis techniques. Colvin is a past AV Chair, Expo Chair, and Tutorial Chair for ISTFA and has been active since 1990. He has worked as a consultant for over 30 years and originated the passive voltage contrast (PVC) technique and pushed a reluctant industry to accept the validity of the atomic force microscope/SPM for imaging and capacitive implant profiling. The joy and passion of inventing led to the first portable emission microscope, the vibration coupler, and the laser illuminator, to name a few. Currently, he is the CEO of FA Instruments Inc., a company founded to provide photon emission/thermal laser stimulus and consultation for failure analysis. Current endeavors focus on development of automation software and techniques for system in package sample preparation. Colvin currently holds 15 patents for products relating to the semiconductor field and is recognized as a contributor to the advancement of semiconductor technologies. He currently serves as chair of the ISTFA Sample Prep Users Group. In addition, Colvin is a frequent presenter at ISTFA and has published nearly twenty articles, including articles and guest editorials in EDFA magazine. His two most recent publications are in the 7th Edition Microelectronics Desk Reference for “Frontside Sample Preparation” and “Backside Preparation and Optics.” Vision Statement Bridging the gap between management and failure analysis only happens with communication. ISTFA and EDFAS are important forums to highlight the value of problem solving and its “cost.” The horrible cost in low yields and returns for not having failure analysis far outstrips the cost of having competent FA resources. With the unusual times we live in, and the great deal of consolidation of the semiconductor industry, we are losing sight of the high cost of failure with poorly manufactured goods. The analysis time vs. usefulness of the data obtained in failure analysis is frequently inversely proportional yet the “need for report speed” sometimes prevails over quality. The importance of ISTFA to convey the failure analysis “mindset” is more important than ever. Failure analysis is the one field where you get to interface closely with design and production and use cool toys. I greatly enjoy working with other experts in the field and brainstorming both technical and managerial problems. ISTFA and EDFAS have an opportunity to get new analysts to think beyond flowchart FA and maximize critical thinking skills for the constant set of new and unusual problems. Rosalinda (Rose) Ring is an innovative self-motivated professional with a “can do” attitude and ability to define and solve issues in a collaborative environment. She led, directed, and supervised teams of engineers and technicians in providing wafer and package-level failure analysis support in start-up, development, and high-volume manufacturing environments. She is also skilled at working in a multicultural environment. Her experience includes working with major foundries and partners and playing an integral role in cross-functional teams that helped companies pass customer audits and receive a high approval rating in quality and operations. She successfully assisted assembly sites and outsourcing suppliers in Asia and the U.S. to pass customers’ quality assessments while increasing production capacity during high-demand seasons, thus growing sales and revenue. Ring’s qualifications include: Playing a significant role as a new product introduction and technology transfer engineer for Intel (Cu/90 nm) and GF-IBM Alliance (20 nm) and 14 nm engineering technology point of contact; serving as key scientist on metrology and FA tools and techniques development, including mentoring and developing recipes and BKMs, and providing tutorials to engineers and technicians; and AMD and GlobalFoundries’ engineering ambassador to various universities and colleges. She holds 47 patents on various FA-related subjects (Ga probe, FIB/SEM GIS, circuit edit, and EBIC endpointing mechanism). During her career in semiconductor failure analysis, she worked as staff FA engineer at Kionix Inc., staff FA engineer at Qorvo Inc., MTS/FA engineer at GlobalFoundries Inc., FA manager at Standard
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