edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 3 DEPARTMENTS Author Guidelines Author guidelines and a sample article are available at edfas.org. Potential authors should consult the guidelines for useful information prior to manuscript preparation. A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS AUGUST 2023 | VOLUME 25 | ISSUE 3 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS 2 GUEST EDITORIAL Peter Friedrichs 38 SPECIAL ISTFA 2023 PREVIEW Frank Altmann 40 ISTFA EXHIBITORS LIST 41 2023 PHOTO CONTEST 42 2023 VIDEO CONTEST 43 EDUCATION NEWS Navid Asadi 44 IN MEMORIAM 46 DIRECTORY OF FA PROVIDERS Rosalinda Ring 47 TRAINING CALENDAR Rosalinda Ring 49 LITERATURE REVIEW Michael R. Bruce 51 PRODUCT NEWS Ted Kolasa 54 GUEST COLUMN Chuan Zhang 56 ADVERTISERS INDEX For the digital edition, log in to edfas.org, click on the “News/Magazines” tab, and select “EDFA Magazine.” Four-dimensional Scanning Transmission Electron Microscopy: Part I: Imaging, Strain Mapping, and Defect Detection Aaron C. Johnston-Peck and Andrew A. Herzing 4D-STEM provides researchers with information that can be analyzed in a multitude of ways to characterize a sample’s structure, including imaging, strain measurement, and defect analysis. 4 12 Failure Analysis of Photonic Integrated Circuits Frieder H. Baumann, Brian Popielarski, Ryan Sweeney, Felix Beaudoin, and Ken Giewont This article introduces silicon photonics, describes what is needed for photonics FA, and shows examples of FA in modern silicon photonics circuits. 23 Advancements in Image Pattern Recognition for LIT Hotspot Detection and Classification with Supervised Learning Kyu Kyu Thinn, Rui Zhen Tan, Teh Tict Eng, and Ming Xue The image pattern recognition algorithm for detecting LIT hotspots benefits image processing and can be leveraged to automate FA processes. 12 4 Multilayer Perceptron Development to Identify Plastics using Fluorescence Lifetime Imaging Microscopy Georgekutty Jose Maniyattu, Eldho Geegy, Maximilian Wohlschläger, Nina Leiter, Martin Versen, and Christian Laforsch Plastics can be classified by neural networks that are trained, validated, and tested by frequency domain fluorescence lifetime imaging microscopy measurements. 31 ABOUT THE COVER MOSFET leakage caused by stacking faults and aluminum spiking, both of which have punched through the junction. A break of the drain contact barrier layer allowed the aluminum to diffuse preferentially along the pair of intersecting stacking faults. This DF STEM image is reminiscent of Darth Vader in simmering rage. Photo by Wentao Qin, Onsemi, First Place Winner in False Color Images, 2022 EDFAS Photo Contest. 23 31
RkJQdWJsaXNoZXIy MTMyMzg5NA==