May_EDFA_Digital

edfas.org 35 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 2 liquid-to-liquid thermal shock testing, thermal shock resistance test method, abrasion testing services, polymer hardness testing, thermal expansion, electrical testing, root cause analysis (RCA), chemical analysis, thermal testing, mechanical testing, corrosion testing, failure analysis (FA), impact testing, polymer material testing, optical testing, eddy current testing (ECT), digital radiography (DR), combustion analysis, volatile organic compound (VOC), dielectric constant, AFM, APT, AES, colorimetry, cryogenic transmission electron microscopy (cryo-TEM), differential Hall effect metrology (DHEM), dilatometry, DMA, destructive physical analysis (DPA), DSC, dual beam–FIB, EBIC, electron backscatter diffraction (EBSD), EDS, EELS, evolved gas analysis (EGA), electrochemical analysis, ellipsometry, emissivity, and optical emission spectroscopy (ETV-ICP-OES). MOLECULAR VISTA ANALYTICAL SERVICES 6840 Via del Oro, Suite 110 San Jose, CA 95119 408.915.2595 info@molecularvista.com molecularvista.com/products/contract-analysis-services Services Offered: Contract analysis services (nano-IR analysis services). Tools and Techniques: Infrared photo induced microscope, identify chemical constituents by IR signatures, organic and inorganic chemical mapping, phase distribution and mixing, defect analysis, and correlate PiF-IR with FTIR. NANUS TECH 14th floor, 109, Gwanggyo-ro, Yeongtong-gu Suwon-si, Gyeonggi-do, Republic of Korea 16229 +82.10.9228.4030 mail@nanustech.com www.nanustech.com/eng/main/main.html Services Offered: Reverse engineering (teardown, technical library (+500), patent infringement, product benchmarking, expert service), IP analysis (patent analysis, patent mapping, portfolio evaluation, resident IP specialists), and 3D profiling. THE NATIONAL HIGH MAGNETIC FIELD LABORATORY MAGNET SCIENCE & TECHNOLOGY 1800 E. Paul Dirac Dr. Tallahassee, FL 32310 850.644.0311 frontdesk@magnet.fsu.edu nationalmaglab.org/magnet-development/magnet- science-technology/facilities-capabilities/ Services Offered: Components testing, mechanical and physical properties testing, and microanalysis (micro/ nanostructure of materials) labs. Tools and Techniques: Dual-beam focused ion beam/ field emission scanning electron microscope, JEM-2011 TEM/SEM, JEM-ARM200cF TEM, Leica optical microscope, sample preparation laboratory, components testing, mechanical and physical properties laboratory, CICC magnet shop, resistive magnet shop, HTS winding shop, machine shop, electro-mechanical testing, engineering analysis, mechanical engineering and design, and project management. PVA TEPLA OKOS 2368 Walsh Ave., Suite C Santa Clara, CA 95051 951.741.5294 lisal@pvateplaamerica.com www.pvateplaamerica.com/corporate Services Offered: Scanning acoustic microscopy (SAM) analytical services, applications training and support, complimentary feasibility analysis, contract analysis, and testing services. Tools and Techniques: SAM 302 HD2 and SAM 501 HD2 with scanning ranges from 200 x 200 μm to 500 x 500 mm, focused transmission mode, transducers up to 400 MHz, transducers up to 2000 MHz, rotational scanning, ingot scanning, system customizations, service, and maintenance training. QUASI-S PTE. LTD. (SINGAPORE LAB) 35 Marsiling Industrial Estate Rd. 3 #04-03 Singapore 739257 +65.6383.4386 contact@quasi-s.com.sg www.labs-services.com/analysis-flow-chart Services Offered: Failure analysis, chemical testing, metallurgy analysis, and counterfeit analysis. Tools and Techniques: Optical microscopy, SEM, x-ray, CSAM, mechanical cross section, ion milling cross cutting, FIB cutting, auger electron spectroscopy, SEM, EDS, FIB, FTIR spectroscopy, time-of-flight secondary ion mass spectroscopy, x-ray photoelectron spectroscopy, AFM, decapsulation, dye and pry, electrical verification bench testing, EBSD, electron energy loss spectroscopy, fieldemission SEM, magnetic current imaging, optical beam induced resistance change, photon emission microscopy, Raman spectroscopy, reactive ion etching, STEM, solderability, thermal emission microscope, x-ray diffraction analysis, inductively coupled plasma optical emission spectroscopy, UV-visible spectroscopy, atomic absorption spectroscopy, x-ray fluorescence, micro x-ray fluorescence, gas chromatography mass spectrometry, and inductively coupled plasma mass spectroscopy.

RkJQdWJsaXNoZXIy MTMyMzg5NA==