edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 2 2 PURPOSE: To provide a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers. Nicholas Antoniou Editor/PrimeNano nicholas@primenanoinc.com Mary Anne Fleming Director, Journals, Magazines & Digital Media Joanne Miller Senior Editor Victoria Burt Managing Editor Allison Freeman Production Supervisor ASSOCIATE EDITORS Navid Asadi University of Florida Guillaume Bascoul CNES France Felix Beaudoin GlobalFoundries Michael R. Bruce Consultant David L. Burgess Accelerated Analysis Jiann Min Chin Advanced Micro Devices Singapore Edward I. Cole, Jr. Sandia National Labs Rosine Coq Germanicus Universitié de Caen Normandie Szu Huat Goh Qualcomm Ted Kolasa Northrop Grumman Space Systems Rosalinda M. Ring Thermo Fisher Scientific Tom Schamp Materials Analytical Services LLC David Su Yi-Xiang Investment Co. Paiboon Tangyunyong Sandia National Labs Martin Versen University of Applied Sciences Rosenheim, Germany FOUNDING EDITORS Edward I. Cole, Jr. Sandia National Labs Lawrence C. Wagner LWSN Consulting Inc. GRAPHIC DESIGN Jan Nejedlik, jan@designbyj.com PRESS RELEASE SUBMISSIONS magazines@asminternational.org Electronic Device Failure Analysis™ (ISSN 1537-0755) is published quarterly by ASM International®, 9639 Kinsman Road, Materials Park, OH 44073; tel: 800.336.5152; website: edfas. org. Copyright © 2023 by ASM International. Receive Electronic Device Failure Analysis as part of your EDFAS membership. Non-member subscription rate is $175 U.S. per year. Authorization to photocopy items for internal or personal use, or the internal or personal use of specific clients, is granted by ASM International for libraries and other users registered with the Copyright Clearance Center (CCC) Transactional Reporting Service, provided that the base fee of $19 per article is paid directly to CCC, 222 Rosewood Drive, Danvers, MA 01923, USA. Electronic Device Failure Analysis is indexed or abstracted by Compendex, EBSCO, Gale, and ProQuest. 2023 marks the 25th anniversary of the ASM Electronic Device Failure Analysis Society (EDFAS). EDFAS was created to address the specific needs of our technical community. In 1998, the steering committee of the International Symposium for Testing and Failure Analysis (ISTFA) put forth a recommendation to the ASM Board of Trustees, and with their approval, EDFAS, a new ASM affiliate society, was formed. Today our society has more than one thousand members across all regions of the world. In addition to the ISTFA conference, the Society publishes this magazine and the EDFAS Desk Reference. The EDFAS board supports numerous committees including membership, educational, and technology roadmap committees. These engagements are only possible thanks to hundreds of volunteers like you who dedicate time and effort to create a society for sharing knowledge and exchanging ideas within our competitive industry. EDFAS strives to provide the knowledge and tools for our members to succeed in the field of failure analysis through a focus on three key strategic areas: ENGAGE: We commit to engaging with our members throughout the year by increasing the frequency of activities in addition to the ISTFA conference. For example, we have created an opportunity to meet virtually with experienced professionals through the speaker’s series. We also leverage the latest features of ASM Connect to help facilitate community discussions through the personalized discussion feed and quick access to EDFAS relevant items. EMPOWER: We support the development of technical content and ensure that it is broadly accessible in ASM Connect and in the ASM Digital Library. Our priority is to make certain that ISTFA remains the premier conference and exhibition for the global electronic failure analysis industry. We will endeavor to double our effort in the EDFAS technology roadmap initiative by collaborating with semiconductor and equipment manufacturing institutes. MAY 2023 | VOLUME 25 | ISSUE 2 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS GUEST EDITORIAL WHAT’S EDFAS ALL ABOUT AFTER A QUARTER CENTURY? Felix Beaudoin, EDFAS President, GlobalFoundries felix.beaudoin@globalfoundries.com Renee Parente, EDFAS Vice-President, AMD renee.parente@amd.com James Demarest, EDFAS Immediate Past President, IBM jjdemar@us.ibm.com edfas.org Beaudoin (continued on page 48) Parente Demarest
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