edfas.org 13 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 2 makes circuit edit and the ability to deliver a functional device in a timely fashion very valuable to an organization. SUGGESTED REFERENCES 1. C. Park, et al.: “FIB Overview,” Microelectronics Failure Analysis: Desk Reference (Seventh Edition), ASM International, 2019, https://doi. org/10.31399/asm.tb.mfadr7.t91110335. 2. M. DiBattista and T.R. Lundquist: “Role of Advanced Circuit Edit for First Silicon Debug,” Microelectronics Failure Analysis: Desk Reference (Seventh Edition), ASM International, 2019, https://doi.org/10.31399/ asm.tb.mfadr7.t91110351. 3. K.A. Serrels and U. Ganesh: “Laser Voltage Probing of Integrated Circuits: Implementation and Impact,” Microelectronics Failure Analysis: Desk Reference (Seventh Edition), ASM International, 2019, https://doi.org/10.31399/asm.tb.mfadr7.t91110244. has few secondary electrons, but metals such as copper and aluminum have many. Consequently, the transition between materials appears as a step function in the emission-level graph. When milling through an insulator, there will be an upward step when a metal line or layer is reached. When cutting through a metal line or layer, there will be a downward step when the cut is complete. CONCLUSION For circuit edit practitioners, it is a very exciting time, and it is expected that the circuit edit function will continue to grow in strategic value. As devices and manufacturing processes become more complex with more steps, the probability of functional defects becomes higher. This ABOUT THE AUTHOR David Akerson is a senior global market development manager in Thermo Fisher Scientific’s Semiconductor Business and has over 20 years of product management and marketing management experience in the semiconductor industry. NOTEWORTHY NEWS FIB SEM MEETING 2023 The 15th annual FIB SEM Meeting will be held June 11-16, in conjunction with IUMAS 8 in Banff, AB Canada. FIB SEM will feature presentations, tutorials, and posters by FIB users and vendors, highlighting new applications and the latest technology. The event offers plenty of technical content as well as opportunities for informal discussions with your FIB colleagues. FIB SEM 2024 will be held back in the Maryland/DC area. For more information, visit fibsem.net or email keana.scott@nist.gov. IPFA 2023 The 30th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) will be held in July 2023 in Penang, Malaysia. The event will be devoted to the fundamental understanding of the physical characterization techniques and associated technologies that assist in probing the nature of wearout and failure in conventional and new CMOS devices, in turn resulting in improved know-how of the physics of device, circuit, and module failure that serves as critical input for future design and reliability. The symposium is technically cosponsored by the IEEE Electron Device Society and IEEE Reliability Society. For more information, visit the IPFA website at ipfa-ieee.org.
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